Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M3TGK-3406R

M3TGK-3406R

3M

IDC CABLE - MSD34K/MC34M/MCS34K

0

C8PPG-4036G

C8PPG-4036G

CW Industries

DIP CABLE - CDP40G/AE40G/CDP40G

0

M3URK-2006J

M3URK-2006J

3M

IDC CABLE - MKS20K/MC20G/MPR20K

0

M3AWK-2036R

M3AWK-2036R

3M

IDC CABLE - MSC20K/MC20M/MPL20K

0

2147511022

2147511022

Woodhead - Molex

MICROFIT 3.0 SR R-S 2CKT 300 MM

656

FFSD-19-D-08.00-01-N

FFSD-19-D-08.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

45114-010030-3749/14-S-6

45114-010030-3749/14-S-6

3M

SGL END CBL ASSY 14POS SKT 6"

2

H0PPS-1606G

H0PPS-1606G

ASSMANN WSW Components

DIP CABLE - HDP16S/AE16G/HDP16S

0

H3CKH-1036M

H3CKH-1036M

ASSMANN WSW Components

IDC CBL - HHKC10H/AE10M/HHPK10H

0

A8MMS-6006M

A8MMS-6006M

TE Connectivity AMP Connectors

ADM60S/AE60M/ADM60S

0

FFSD-17-D-04.35-01-N

FFSD-17-D-04.35-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-17-D-59.06-01-N-RW

FFSD-17-D-59.06-01-N-RW

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

H3AAS-2036M

H3AAS-2036M

ASSMANN WSW Components

IDC CBL - HHSC20S/AE20M/HHSC20S

0

H3DDS-4006M

H3DDS-4006M

ASSMANN WSW Components

IDC CBL - HHKR40S/AE40M/HHKR40S

0

2162911011

2162911011

Woodhead - Molex

STANDARD .093 1 CIRCUIT R TO S 1

0

C3BBG-5018M

C3BBG-5018M

CW Industries

IDC CABLE - CSR50G/AE50M/CSR50G

0

G125-MC12605M1-0150F1

G125-MC12605M1-0150F1

Harwin

CBL GECKO 1.25MM M-F 150MM 26POS

4

C3BES-2036G

C3BES-2036G

CW Industries

IDC CABLE - CSR20S/AE20G/CCE20S

0

1451320303

1451320303

Woodhead - Molex

MICRO-FIT TPA-TO-MICRO-FIT TPA O

249

FFSD-10-D-03.65-01-N

FFSD-10-D-03.65-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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