Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
A3CKB-5036G

A3CKB-5036G

TE Connectivity AMP Connectors

IDC CABLE - AKC50B/AE50G/APK50B

0

HLCD-40-12.00-TD-TH-2

HLCD-40-12.00-TD-TH-2

Samtec, Inc.

CBL ASSM SELF-MATE 80POS 12" HDR

0

FFSD-17-D-25.00-01-N

FFSD-17-D-25.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A3CCB-4406M

A3CCB-4406M

TE Connectivity AMP Connectors

IDC CABLE- AKC44B/AE50M/AKC44B

0

C3AAS-5006M

C3AAS-5006M

CW Industries

IDC CABLE - CSC50S/AE50M/CSC50S

0

0151330803

0151330803

Woodhead - Molex

PICO-CLASP 8 CIRCUIT 300MM

331

M1BXK-6040K

M1BXK-6040K

3M

IDC CABLE - MSR60K/MC60F/X

0

A3RRB-1418M

A3RRB-1418M

TE Connectivity AMP Connectors

IDC CABLE - APR14B/AE14M/APR14B

0

0451360201

0451360201

Woodhead - Molex

MEGA-FIT 2 CIRCUIT 150MM

220

0923151601

0923151601

Woodhead - Molex

16CKT PICOFLEX 1000MM LONG

0

FFSD-10-D-03.00-01-N-RW

FFSD-10-D-03.00-01-N-RW

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-23-D-02.00-01-N

FFSD-23-D-02.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3CCA-4040K

M3CCA-4040K

3M

IDC CABLE - MKC40A/MC40F/MKC40A

0

45110-010030-7700/10-G-24

45110-010030-7700/10-G-24

3M

CABLE ASSY 10 POS 24" PINOUT-G

0

H3BBS-1036M

H3BBS-1036M

ASSMANN WSW Components

IDC CBL - HHSR10S/AE10M/HHSR10S

0

FFSD-13-D-06.56-01-N

FFSD-13-D-06.56-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

0151341000

0151341000

Woodhead - Molex

PICOBLADE 10 CIRCUIT 50MM

263

A3BRB-5006M

A3BRB-5006M

TE Connectivity AMP Connectors

IDC CABLE - ASR50B/AE50M/APR50B

0

2174651043

2174651043

Woodhead - Molex

ULTRA-FIT SR R-R 4CKT 600MM DISC

0

A3DDH-4406G

A3DDH-4406G

TE Connectivity AMP Connectors

IDC CABLE - AKR44H/AE44G/AKR44H

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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