Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M3DDA-2020K

M3DDA-2020K

3M

IDC CABLE - MKR20A/MC20F/MKR20A

0

T1SDT-05-28-GF-02.0-T3

T1SDT-05-28-GF-02.0-T3

Samtec, Inc.

CBL ASSY 1MM 10POS M TO F

20

A02DS02DS28W305B

A02DS02DS28W305B

JST

JUMPER 02DS-8E - 02DS-8E 12"

186

FFSD-17-D-02.40-01-N-RW

FFSD-17-D-02.40-01-N-RW

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M3UGK-3436J

M3UGK-3436J

3M

IDC CABLE - MKS34K/MC34G/MCS34K

0

T1PD-07-28-GF-12.0-A-T3

T1PD-07-28-GF-12.0-A-T3

Samtec, Inc.

CBL 1MM 14POS PNL MNT M TO F

0

FFSD-17-D-09.00-01-N-R

FFSD-17-D-09.00-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

A3AKB-1418G

A3AKB-1418G

TE Connectivity AMP Connectors

IDC CABLE - ASC14B/AE14G/APK14B

0

A1CXH-6436G

A1CXH-6436G

TE Connectivity AMP Connectors

IDC CABLE - AKC64H/AE64G/X

0

H1KXH-2036G

H1KXH-2036G

ASSMANN WSW Components

IDC CBL - HHPK20H/AE20G/X

0

A3RRB-1036G

A3RRB-1036G

TE Connectivity AMP Connectors

IDC CABLE - APR10B/AE10G/APR10B

0

M3UUK-4018J

M3UUK-4018J

3M

IDC CABLE - MKS40K/MC40G/MKS40K

0

FFSD-10-D-59.00-01-N

FFSD-10-D-59.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

0369220206

0369220206

Woodhead - Molex

DITTO 2 CIRCUIT WTW 600MM

2161

FFSD-13-D-41.80-01-N

FFSD-13-D-41.80-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

45120-010030-3749/20-S-6

45120-010030-3749/20-S-6

3M

SGL END CBL ASSY 20POS SKT 6"

7

M3GGK-2040K

M3GGK-2040K

3M

IDC CABLE - MCS20K/MC20F/MCS20K

0

C8RRG-4006M

C8RRG-4006M

CW Industries

DIP CABLE - CDR40G/AE40M/CDR40G

0

45116-010030-3749/16-D-6

45116-010030-3749/16-D-6

3M

DBL END CBL ASY 16POS SKT 6"

0

A1DXH-3036M

A1DXH-3036M

TE Connectivity AMP Connectors

IDC CABLE - AKR30H/AE30M/X

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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