Rectangular Cable Assemblies

Image Part Number Description / PDF Quantity Rfq
M3CCK-1036J

M3CCK-1036J

3M

IDC CABLE - MKC10K/MC10G/MKC10K

0

AK5430-.5

AK5430-.5

ASSMANN WSW Components

CABLE HDD CONN 2XIDE/AT BUS HDD

1883

0451110306

0451110306

Woodhead - Molex

MICROLOCK PLUS CABLE BLACK 3 CKT

627

M3GGK-1640K

M3GGK-1640K

3M

IDC CABLE - MCS16K/MC16F/MCS16K

0

FFSD-13-D-43.00-01-N

FFSD-13-D-43.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSY

0

FFSD-05-D-03.75-01-N

FFSD-05-D-03.75-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

FFSD-10-D-32.00-01-N-R

FFSD-10-D-32.00-01-N-R

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

M1WXK-4040K

M1WXK-4040K

3M

IDC CABLE - MPL40K/MC40F/X

0

C6RRS-1636G

C6RRS-1636G

CW Industries

DIP CABLE - CDR16S/AE16G/CDR16S

0

C3AAG-1606G

C3AAG-1606G

CW Industries

IDC CABLE - CSC16G/AE16G/CSC16G

0

A3BBH-1406M

A3BBH-1406M

TE Connectivity AMP Connectors

IDC CABLE - ASR14H/AE14M/ASR14H

0

FFSD-05-D-63.00-01-N

FFSD-05-D-63.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSE

0

2153251042

2153251042

Woodhead - Molex

MINIFIT JR DR R-R 4 CIRCUIT 300M

0

M80-FC305F1-06-0450L

M80-FC305F1-06-0450L

Harwin

CBL ASS RG178 FMALE 450MM 6POS

7

H3WWH-1606M

H3WWH-1606M

ASSMANN WSW Components

IDC CBL - HHPL16H/AE16M/HHPL16H

0

A3CCB-1636M

A3CCB-1636M

TE Connectivity AMP Connectors

IDC CABLE- AKC16B/AE16M/AKC16B

0

H3BKH-2606G

H3BKH-2606G

ASSMANN WSW Components

IDC CBL - HHSR26H/AE26G/HHPK26H

0

1451350410

1451350410

Woodhead - Molex

MINI-FIT 4 CIRCUIT 1M

1504

FFSD-08-D-20.00-01-N

FFSD-08-D-20.00-01-N

Samtec, Inc.

.050 X .050 C.L. FEMALE IDC ASSY

25

A3CCH-4018G

A3CCH-4018G

TE Connectivity AMP Connectors

IDC CABLE - AKC40H/AE40G/AKC40H

0

Rectangular Cable Assemblies

1. Overview

Rectangular cable assemblies are engineered interconnect solutions featuring rectangular-shaped connectors and integrated cables. They enable reliable signal, data, and power transmission in electronic systems. These assemblies are critical in modern technology for their compact design, high-density connectivity, and robust performance in demanding environments.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
D-SubminiatureMetal-shielded, screw-locking designIndustrial computers, military equipment
IDC (Insulation Displacement)Tool-less termination, flat cable compatibilityTelecom switches, HVAC systems
Board-to-BoardLow-profile, high-pin-count optionsServers, medical imaging devices
Ribbon CableParallel signal routing, flexible dielectricComputer peripherals, test equipment

3. Structure and Components

Typical construction includes:

  • Contact elements: Phosphor bronze or beryllium copper with gold/silver plating
  • Insulation: High-temperature thermoplastic (e.g., LCP, PBT)
  • Shielding: Braided copper or conductive polymer layers
  • Strain relief: Molded thermoplastic overbraiding
  • Connector housing: Glass-filled nylon for mechanical stability

4. Key Technical Parameters

ParameterTypical RangeImportance
Rated Voltage50V - 600VEnsures dielectric safety
Current Capacity1A - 15A per contactDetermines power handling
Contact Resistance5-20m Impacts signal integrity
Insulation Resistance100M - 10G Prevents leakage currents
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500 - 5000 cyclesDurability indicator

5. Application Fields

Primary sectors include:

  • Computer & Peripherals: Server backplanes, GPU interconnects
  • Telecommunications: 5G base stations, optical network terminals
  • Industrial Automation: PLC interfaces, robotic controllers
  • Medical Equipment: MRI scanners, diagnostic devices
  • Transportation: EV battery management systems, avionics

6. Leading Manufacturers

ManufacturerKey Products
Amphenol CorporationD-Sub 90 PCB Mount Series
TE ConnectivityMATE-AX High-Speed Backplane Cables
Molex LLCPicoBlade 0.8mm Wire-to-Board Cables
Samtec Inc.QTE High-Density Array Cables

7. Selection Guidelines

Key considerations:

  • Electrical requirements (voltage/current profiles)
  • Mechanical constraints (space limitations, vibration exposure)
  • Environmental factors (temperature extremes, chemical exposure)
  • Signal integrity needs (impedance control, crosstalk reduction)
  • Cost-effectiveness across production volumes

Example: Industrial IoT gateways require IP67-rated assemblies with EMI shielding for factory floor deployment.

8. Industry Trends

Emerging developments include:

  • Miniaturization: 0.4mm pitch connectors for mobile devices
  • High-speed capabilities: 25+ Gbps differential pair designs
  • Smart integration: Embedded sensors for condition monitoring
  • Sustainability focus: Halogen-free materials adoption
  • Automated manufacturing: AI-driven quality control systems
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