Accessories

Image Part Number Description / PDF Quantity Rfq
T0058701723

T0058701723

Xcelite

SENSOR PT-20.2 58701723

0

37BK

37BK

Xcelite

HEATER 50W FOR THREAD-ON TIPS

0

KDS900S

KDS900S

Xcelite

MALE CONNECTOR 5/PK

0

100-2012-ESDN

100-2012-ESDN

Xcelite

PARTICLE FILTER H13/GAS FILTER M

9

EC229A

EC229A

Xcelite

SENSOR 7/ EC1201A

0

0F10

0F10

Xcelite

FLEXIBLE,ADJUSTABLE ARM 1000MM C

15

FT91000033

FT91000033

Xcelite

REMOTE SWITCH

4

130-2000-ESDN

130-2000-ESDN

Xcelite

H13 REPLACEMENT FILTER FOR MG130

0

100UG

100UG

Xcelite

ADAPTER 1/8 INCH TIP

0

T0058751710N

T0058751710N

Xcelite

TOOL FOR CHANGING NT TIPS

13

T0053658099

T0053658099

Xcelite

WF 32 EXTRACTION ARM

0

WPAB

WPAB

Xcelite

WPA2 BURNER UNIT (WPA-B)

0

T0058770714

T0058770714

Xcelite

ASSY BARREL NUT FOR WEP70

30

W58713799

W58713799

Xcelite

PART CSF RUBBER INSERT 799 10/PK

0

T0058768734N

T0058768734N

Xcelite

SILICON PAD REPLACEMENT FOR WT1/

5

T0058762770N

T0058762770N

Xcelite

KIT1 WF 32 NOZZLE F. WFE S FUME

0

T0058735938

T0058735938

Xcelite

FINE DUST FILTER F7 2S/ZS4V (10)

0

KDS806

KDS806

Xcelite

FOOT VALVE

9

D550RH

D550RH

Xcelite

REPL HOUSING FOR WELLER D550

0

T0054461799N

T0054461799N

Xcelite

FINE POINT CARTRIDGE RT2MS 0.4MM

49

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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