Accessories

Image Part Number Description / PDF Quantity Rfq
T0058735845N

T0058735845N

Xcelite

SHADE PC-TRANSP 200X100

0

T0058744855N

T0058744855N

Xcelite

HEATING ELEMENT WP 80

17

T0052512599N

T0052512599N

Xcelite

FE ASSEMBLY FOR LR 21/TCP S

0

T0058762766

T0058762766

Xcelite

TPIECE 60MM WITH 2 CONNECTING PL

0

T0058762858

T0058762858

Xcelite

H13 PARTICLE FILTER AND GAS FILT

5

KDS900

KDS900

Xcelite

MALE CONNECTER LARGE BARB 5/PK

0

T0058744876

T0058744876

Xcelite

FE-CLIP SET FOR FE ADAPTER 6.0

0

6T2ADRY

6T2ADRY

Xcelite

AIR OP STOPPER 6CC F/TAPER TIP D

0

T0051504999N

T0051504999N

Xcelite

WHA NOZZLE EXCHANGE TOOL

0

9037

9037

Xcelite

TIP RETAINER FOR STANDARD TIPS

0

T0058744875

T0058744875

Xcelite

KIT SPARE PARTS FOR 0052918599

0

T0058741783

T0058741783

Xcelite

CLOS VALVE DSV-80 SP 58741783

42

T0058748852N

T0058748852N

Xcelite

FILTER WDD/WXD

0

T0051360599

T0051360599

Xcelite

GLASS TUBE FOR DS80 IRON PKG/4

9

T0053119099

T0053119099

Xcelite

TEMPERATURE SENSOR FOR WCB2

0

T0058741821

T0058741821

Xcelite

CLOSING VALVE DXV80

32

KN100A

KN100A

Xcelite

WELLER TIP NUT FOR W100D A

0

T0058762772

T0058762772

Xcelite

WFE TWIN CONNECTING SLEEVE 60MM

0

T0058762724N

T0058762724N

Xcelite

ADAPTER FOR REMOTE CONTROL ZERO

0

T0058762753

T0058762753

Xcelite

WFE ADAPTER 50-60MM KIT W. O-RIN

9

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

RFQ BOM Call Skype Email
Top