Accessories

Image Part Number Description / PDF Quantity Rfq
HE35

HE35

Xcelite

HEATER ASSY FOR WP35 HE35

0

3LL2

3LL2

Xcelite

STOPPER 3CC 1000/PK

0

S30T-2CH

S30T-2CH

Xcelite

STOPPER 30CC MANUAL

20

HE30

HE30

Xcelite

HEATER 30W FOR WP30 IRON

0

T0058765766N

T0058765766N

Xcelite

BARREL FOR BENT XT TIPS WXP 120

8

T0058744845N

T0058744845N

Xcelite

TIP RETAINER ASSY SHORT FOR WP80

48

T0052704299N

T0052704299N

Xcelite

SOLDER BATH 150W 24V

0

T0058765778N

T0058765778N

Xcelite

GLASS TUBE WITH STRAP FOR WXDP 1

18

T0058764712N

T0058764712N

Xcelite

ADAPTER FOR WFE/WHP WX

0

EC231

EC231

Xcelite

BARREL NUT ASSMB REPL F/EPH TIP

0

T0058755782

T0058755782

Xcelite

K THERMOCOUPLE FOR WHA300

0

D550HEXCOL

D550HEXCOL

Xcelite

COLLAR HEX SCREW D550

71

TSM1

TSM1

Xcelite

SOLDER-MATE 1LB SOLDER DISPENSER

64

HE40

HE40

Xcelite

HEATER 40W FOR SP40 IRON

0

7324

7324

Xcelite

SWITCH DUAL HEAT GUN

0

T0058744711N

T0058744711N

Xcelite

HEATER/SENSOR FOR WSP80

59

T0058768747N

T0058768747N

Xcelite

TNA NOZZLE ADAPTER

9

KDS530SN

KDS530SN

Xcelite

ADAPTER HEAD 30CC

0

WP70S

WP70S

Xcelite

PYROPEN WP70S SOLDER EJEC

0

1237S

1237S

Xcelite

HEATER FOR THREAD-ON TIPS 33W

7

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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