Accessories

Image Part Number Description / PDF Quantity Rfq
KDS503SN

KDS503SN

Xcelite

ADAPTER HEAD 3CC

0

0F15

0F15

Xcelite

FLEXIBLE,ADJUSTABLE ARM 1500MM C

5

T0053641099

T0053641099

Xcelite

REPL FILTER CARTRIDGE FOR WFE2P

0

KDS810SN

KDS810SN

Xcelite

ADAPTER HEAD 10CC

0

T0058744795N

T0058744795N

Xcelite

TIP RETAINER NUT FOR WSP150

0

T0058762769

T0058762769

Xcelite

INTAKE FITTING 60 90 DEG ANGLE F

0

T0058765715

T0058765715

Xcelite

CORD FOR WXP/WXDP 120 1.6M

0

T0051312599N

T0051312599N

Xcelite

FE ASSEMBLY FOR DS 21 DS22 DS8

0

T0058759725N

T0058759725N

Xcelite

AIR FILTERS FOR WR3M 3/PK

23

DSH54

DSH54

Xcelite

HEATER DS800 24V 54W A

0

SW60

SW60

Xcelite

SWITCH ASSM FOR SOLD PENCIL

10

DS205

DS205

Xcelite

INLINE FILTER FOR DS700

0

T0058765802N

T0058765802N

Xcelite

BARREL FOR BENT XT TIPS WP 120

0

T0058764710

T0058764710

Xcelite

CABLE INTERFACE WX CONNECTION

0

T0053316599N

T0053316599N

Xcelite

WBHS PCB HOLDER W. TRIPOD

0

T0052704099N

T0052704099N

Xcelite

SOLDER BATH 80W 24V

0

T0052918699N

T0052918699N

Xcelite

FE ADD-ON KIT TUBE 6 MM

0

T0053316799

T0053316799

Xcelite

WBH 2 BOARD HOLDER

4

9908

9908

Xcelite

HEATER REPLACE ELEMENT FOR 921Z

0

T0053641400

T0053641400

Xcelite

SUCTION HOSE NB44 W/O END CAP

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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