Accessories

Image Part Number Description / PDF Quantity Rfq
T0053659099N

T0053659099N

Xcelite

REPLACEMENT FILTER WFE 2X

0

T0058735847

T0058735847

Xcelite

INTAKE STACK SYST. 50 STRAIGHT W

0

KDS503S6N

KDS503S6N

Xcelite

ADAPTER 3CC

63

KN60

KN60

Xcelite

NUT KNURLED TIP WP25/30/35

7

30T2A

30T2A

Xcelite

STOPPER 30CC AIR DRY 50/PK

0

T0058735835

T0058735835

Xcelite

ACTIVE CARBONE FILTER WFE4S/ZERO

0

T0053659899N

T0053659899N

Xcelite

WF STATIV EXTRACTION ARM

0

T0058744761N

T0058744761N

Xcelite

HEATING ELEMENT WSP 150

0

7882BK

7882BK

Xcelite

TIP FOR 7880 DESOLDER PUMP BULK

0

T0052921499N

T0052921499N

Xcelite

FE ADD ON KIT TUBE 06MM F. WX PE

0

145-2000-ESDN

145-2000-ESDN

Xcelite

H13 REPLACEMENT FILTER FOR MG140

0

T0058711719

T0058711719

Xcelite

FILTER CAP,58711719

0

T0058735837

T0058735837

Xcelite

FINE-PART. FILTER F5 WFE4S/20D

0

FT-PN

FT-PN

Xcelite

METAL NOZZLE 300 MM

0

T0058741732

T0058741732

Xcelite

CSF-D 11.0 X 26.5HEAD 58741732

0

T0058768727N

T0058768727N

Xcelite

WSRF 200 FUNNEL F. WSR 200/WDH 5

0

T0058762763N

T0058762763N

Xcelite

KIT1S WF FUNNEL STATIV F. WFE VO

1

T0058736819N

T0058736819N

Xcelite

NA10 ADAPTER REPACHIP 58750722

0

T0058768765

T0058768765

Xcelite

OPEN BARREL WTP/WXP 90 PACKED

0

T0058735884

T0058735884

Xcelite

FINE-PARTICUL. GAS FILTER F5 WFE

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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