Accessories

Image Part Number Description / PDF Quantity Rfq
T0053657499N

T0053657499N

Xcelite

STOP VALVE FOR WFE2S & WFE2ES

9

T0058768726N

T0058768726N

Xcelite

TIP CHANGE TOOL FOR WTP90

28

WP71T

WP71T

Xcelite

WP71T TORCH EJECTOR (70-07TU)

0

T0058741822N

T0058741822N

Xcelite

HEATING ELEMENT DXV 80

0

T0058735895N

T0058735895N

Xcelite

FUME EXTRACTOR CTN FILTR WFE2S/2

0

HE25

HE25

Xcelite

HEATER 25W FOR WP25 IRON

1

7883

7883

Xcelite

TIP FOR 7881 DESOLDER PUMP

0

1237SBK

1237SBK

Xcelite

HEATER FOR THREAD-ON TIPS 33W

0

T0051360399N

T0051360399N

Xcelite

GASKETS GLASS TUBE (10)

0

KDS825

KDS825

Xcelite

PANEL MOUNT COUPLER KDS825

0

37UG

37UG

Xcelite

HEATER 50W FOR THREAD-ON TIPS

12

T0058735936N

T0058735936N

Xcelite

COMPACT FILTER HEPA E12 GASF. WF

0

T0051325899N

T0051325899N

Xcelite

XDS 9 MEASURING TIP

0

T0058765758N

T0058765758N

Xcelite

BARREL FOR WP 65 / WXP 65

89

K1111

K1111

Xcelite

TIP THERMOCOUPLE WELD LTB

0

130-2010

130-2010

Xcelite

F7 PRE-FILTER FOR MG130 1=5 PCS

6

T0058744846N

T0058744846N

Xcelite

TIP RETAINER ASSY LONG FOR WP80

32

HEW60P

HEW60P

Xcelite

HEATER 60W FOR W60P IRON

0

T0058735925

T0058735925

Xcelite

EXTRACTION HOSE 50 MM 3M LENGT

0

PW50

PW50

Xcelite

LOCKOUT PENCIL FOR WES50/51 A

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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