Accessories

Image Part Number Description / PDF Quantity Rfq
KDS830S6N

KDS830S6N

Xcelite

ADAPTER 30CC

36

145-4000

145-4000

Xcelite

F7 PRE-FILTER FOR MG140 1=2 PCS

8

TC208

TC208

Xcelite

HEATING ELEMENT FOR SOLDERING

3

T0058765776

T0058765776

Xcelite

FILTER D17 FOR GLASS TUBE WXDP 1

41

4037SBK

4037SBK

Xcelite

HEATER 45W FOR THREAD-ON TIPS

0

KDS810S6N

KDS810S6N

Xcelite

ADAPTER 10CC

27

K181

K181

Xcelite

TIP THERMOCOUPLE WELD LTB

0

WSA350F

WSA350F

Xcelite

FILTERS CARBON FOR WSA350 3/PK

703

T0053119199

T0053119199

Xcelite

INTERFACE CABLE 2M 53119199

0

10LL2DRY

10LL2DRY

Xcelite

STOPPER 10CC 1000/PK

0

T0058706794N

T0058706794N

Xcelite

CONICAL CLEANING INSERT DSX/DXV

0

EC233

EC233

Xcelite

CORD ASSEMBLY A

10

T0058735838

T0058735838

Xcelite

COMPACT FILTER WFE4S/WFE20D/ZERO

0

T0058744713

T0058744713

Xcelite

CORD FOR WSP 80 / WP 80 / WP 120

0

T0058758721N

T0058758721N

Xcelite

FUNNEL FOR WSP/WP 80 WDH 10 STA

26

4035SBK

4035SBK

Xcelite

HEATER BULK 45W FOR THREAD

0

T0058768725N

T0058768725N

Xcelite

REPLACEMENT HEATING ELEMENT FOR

5

T0058765773N

T0058765773N

Xcelite

CLEANING TOOL WXDP/DSX 120

15

12T2ADRY

12T2ADRY

Xcelite

AIR STOPPER 10-12CC DRY 500/PK

0

T0058735848

T0058735848

Xcelite

INTAKE STACK SYST. 50 90 WFE 2S

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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