Accessories

Image Part Number Description / PDF Quantity Rfq
T0058757026

T0058757026

Xcelite

CLAMPING NUT

0

T0058762774

T0058762774

Xcelite

END CAP FOR EASY CLICK 060MM

0

T0052609899N

T0052609899N

Xcelite

EXTENSION CORD FOR IRON 80W 3M

5

T0058768767

T0058768767

Xcelite

WT HUB

0

T0058735937

T0058735937

Xcelite

FINE DUST FILTER M5 2S/ZS4V (10)

0

T0058741743

T0058741743

Xcelite

CSF QI 30,5X30,5 HEAD

0

700-3057

700-3057

Xcelite

REMOTE CONTROL MG-UNITS

3

T0058741715

T0058741715

Xcelite

CSF ADAPTER 06.0 DS

0

T0058766725

T0058766725

Xcelite

DOWN HOLDER WQB 4000 F. PCB HOLD

0

T0058741733

T0058741733

Xcelite

CSF Q 12.0X12.0 HEAD

0

T0058750786N

T0058750786N

Xcelite

HOT GAS NOZZLE NQ 3.7X3.7 W. VAC

0

T0058765799N

T0058765799N

Xcelite

FE ADD-ON KIT TUBE 6.5MM WXP 65

0

145-2012-ESDN

145-2012-ESDN

Xcelite

MIKRO/GASFILTER MG140,SOLVENTS/V

9

GD-80-2000N

GD-80-2000N

Xcelite

REPLACEMENT FILTER GD 80

0

T0058741742

T0058741742

Xcelite

CSF QI 25.4X25.4 HEAD

0

T0058735327

T0058735327

Xcelite

FLEXIBLE TUBING SYST. 50 (M)

0

T0058741803

T0058741803

Xcelite

CSF ADAPTER 06.0 DX

0

T0058741730

T0058741730

Xcelite

CSF D 10.5X16.0 HEAD

0

T0058762846

T0058762846

Xcelite

FIXING CLAMP EXTRACTION ARM SPAR

0

PF-1000

PF-1000

Xcelite

PRE-FILTER MG100

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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