Accessories

Image Part Number Description / PDF Quantity Rfq
T0052704399N

T0052704399N

Xcelite

SOLDER BATH 200W

1

T0058735739

T0058735739

Xcelite

PUMP FOR WFE E/2P/P

0

KDS505S6N

KDS505S6N

Xcelite

ADAPTER 5CC

0

BA60

BA60

Xcelite

ASSY BARREL NUT FOR PES51&50

69

HEW100P

HEW100P

Xcelite

HEATER 100W FOR W100P IRON

0

1235S

1235S

Xcelite

HEATING UNIT 33W FOR THREAD

0

T0058762767N

T0058762767N

Xcelite

INTAKE FITTING 60MM STRAIGHT FOR

0

T0058735924

T0058735924

Xcelite

FILTERBAG FOR STICKY RESIDUES

0

T0058735836

T0058735836

Xcelite

FINE-PART. FILTER F7 WFE4S/20D

0

T0053657999N

T0053657999N

Xcelite

KIT1S WF SLOPED STATIV F. WFE S

0

T362

T362

Xcelite

HEATER 45W/120V FOR 1/4 THREAD O

0

T0053657599

T0053657599

Xcelite

TABLE CLAMP 60 MM (2)

0

T0051312499N

T0051312499N

Xcelite

KIT MAINTENANCE FOR DESLDR PENCL

11

K111

K111

Xcelite

TYPE K THERMOCOUPLE FOR ETA TIP

7

KDS901

KDS901

Xcelite

FEMALE CONNECTOR

0

T0052918599N

T0052918599N

Xcelite

FE ADD-ON KIT TUBE 4.5 MM

0

T0058762701

T0058762701

Xcelite

HEPA FILTER FOR WFE2ES

33

T0058768724N

T0058768724N

Xcelite

BARREL/TIP RETAINER FOR WTP90

14

KDS8101N

KDS8101N

Xcelite

10CC GASKET FOR ADAPTER

21

7805

7805

Xcelite

BULB SOLDER-OFF

6

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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