Accessories

Image Part Number Description / PDF Quantity Rfq
B1182

B1182

Hakko

NUT,NOZZLE,851

0

B2926

B2926

Hakko

CHASSIS,W/FOOT,FX-301B

0

T0058741731

T0058741731

Xcelite

CSF D 10.7X18.0 HEAD

0

56-0005-5744

56-0005-5744

Kester

DROSS INHIBITOR POWDERED 5744 5

0

B3219/P

B3219/P

Hakko

ASSY,SLEEVE,GREEN,LOCKING,A/B,FM

0

B5014

B5014

Hakko

ENCLOSURE,NOZZLE,FR-300

0

300204EB

300204EB

EMIT

BLOWER ALPHA 120V

0

700-3040-ESD

700-3040-ESD

Xcelite

QUICK-CONNECTION HOSE DIA. 60MM

0

T0058741735

T0058741735

Xcelite

CSF Q 12,7X12,7 HEAD

0

485-62

485-62

Hakko

POTENTIOMETER,FLOW LEVEL,485

0

B1885

B1885

Hakko

GEAR,TENSION,373

0

B5016

B5016

Hakko

FILTER,PRE,ALUM.,5PK,FR-300

0

A1548

A1548

Hakko

HEATER,RIGHT SIDE,FX-301B

0

T0058735814

T0058735814

Xcelite

MOTOR CAP REPL FOR WFE2P

0

B3682

B3682

Hakko

HOSE,INNER,6MM X 115L,FM-206

0

B1916

B1916

Hakko

PIPE,FILTER,PIPE ONLY,807

0

T0051504899N

T0051504899N

Xcelite

NOZZLE STAND (6UP) 51504899

0

CX5005

CX5005

Hakko

FEEDER UNIT,0.3-1.6MM,HU-200

0

GD-125-2000N

GD-125-2000N

Xcelite

REPLACEMENT FILTER GD125

0

B1208

B1208

Hakko

STOPPER,CORD,851/373

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

RFQ BOM Call Skype Email
Top