Accessories

Image Part Number Description / PDF Quantity Rfq
B5224

B5224

Hakko

COVER,JOINT,FR-4103

0

A1311

A1311

Hakko

PAD,10MM,394

0

485-20

485-20

Hakko

GAUGE,PLASTIC,485

0

B3427

B3427

Hakko

ASSY,PUMP,FM-204

0

T0058764746N

T0058764746N

Xcelite

NOOT SWITCH FOR WXA/WXD/WXR

0

B1312

B1312

Hakko

CRANK,FR-400/FM-204,472D

0

999-198

999-198

Hakko

HIGH EFFICIENCY FILTER FOR FA-40

4

B1628

B1628

Hakko

RING,ADJUSTMENT,1.0MM,373

0

FT91000037N

FT91000037N

Xcelite

KIT1 EXTRACT.ARM 60 1.5M W. ALFA

0

B5042

B5042

Hakko

CORD,POWER,FR-872

0

T0058768729N

T0058768729N

Xcelite

WSRF 202 FUNNEL F. WSR 202/WDH 3

0

A5006

A5006

Hakko

HEATER,ASSY,W/HEATER PROTECTION

0

B1784

B1784

Hakko

NUT,ENCLOSURE,907/900M/913/980/9

0

A1013

A1013

Hakko

DIAPHRAGM,PUMP,2PK,FR-400/FM-204

0

B1042

B1042

Hakko

FUSE,125V-2A,851

0

145-2003-ESDN

145-2003-ESDN

Xcelite

PARTIKELFILTER H13/GASFILTER MG1

0

CL-6000

CL-6000

Hakko

BLADE,CUTTING,CHAMFERED,TR-6000

0

B3727

B3727

Hakko

ASSY,PIPE,GUIDE,0.8MM,FM-2030,37

0

B3687

B3687

Hakko

NIPPLE,W/O-RING,FM-2031/2030

0

T0058741744

T0058741744

Xcelite

9.0X18.0 HEAD 58741744 CSFDI90

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

RFQ BOM Call Skype Email
Top