Accessories

Image Part Number Description / PDF Quantity Rfq
B1882

B1882

Hakko

SHAFT,TENSION GEAR GUIDE,373

0

T0058727084

T0058727084

Xcelite

QUICK CONNECTOR SOCKET FOR WRS20

0

B1884

B1884

Hakko

KNOB,ADJUST,TENSION,373

0

B1701

B1701

Hakko

NOZZLE,GUIDE,1.0MM,373

0

T0052812699N

T0052812699N

Xcelite

FE ACCESSORY SET FOR WSFP 5/8

0

B5002

B5002

Hakko

PCB,FX-100

0

485-31

485-31

Hakko

AIR HOOD,42 PIN,485

0

999-156

999-156

Hakko

FITTING,Y-TYPE,3IN.,HJ3100

0

485-46

485-46

Hakko

MOTOR,485

0

B1186

B1186

Hakko

GRIP,HANDLE,ESD,900M/900L,851

0

B5229

B5229

Hakko

JIG,NOZZLE,POSITIONING,FR-4003,C

0

B1218

B1218

Hakko

PCB,TEMP. CONTROL,851

0

T0058711718N

T0058711718N

Xcelite

FILTER CARTRIDGE,(4)

0

T0058755745

T0058755745

Xcelite

SUPPORT FOR WQB 3000 / WBH / WBH

0

485-22

485-22

Hakko

GAUGE,HORIZONTAL,485

0

485-74

485-74

Hakko

DIAL,CONTROL,SLOW DOWN,485

0

B2849

B2849

Hakko

BED,COMPONENT,FM-2023

0

T0058762765N

T0058762765N

Xcelite

WFE VALVE FOR EXTRACTION ARM

0

BX1051

BX1051

Hakko

PIPE,GUIDE,1.2-1.6MM,HU-200

0

B1057

B1057

Hakko

RING,BEARING,PUMP,FR-400/FM-204,

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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