Accessories

Image Part Number Description / PDF Quantity Rfq
B5011

B5011

Hakko

PCB,FR-300

0

777-002

777-002

Hakko

SCREW,IMPELLER/JOINT,1EA,485

0

A1438

A1438

Hakko

PAD,7.6MM,5PK,VACUUM PIPE,FR-803

27

B3023

B3023

Hakko

KNOB,(L),HANLDE,ADJUSTMENT,VACCU

0

B3670

B3670

Hakko

PLATE,DIAPHRAGM SETTING,PUMP,FM-

0

A1507

A1507

Hakko

HEATER,817

0

T0058754924

T0058754924

Xcelite

FIXTURE SET F. BOARDS WQB 3000

0

B1703

B1703

Hakko

NOZZLE,GUIDE,1.6MM,373

0

KDS805S6N

KDS805S6N

Xcelite

ADAPTER 5CC

0

B1660

B1660

Hakko

CLIP,HOUSING,807

0

17536A

17536A

Aven

REPLACEMENT TIP FOR 17536 SOLDER

102

999-247

999-247

Hakko

PREHEATER,ANTI-GLARE,SINGLE ZONE

0

B3484

B3484

Hakko

ASSY,PIPE,GUIDE,1.2MM,FM-2027,37

0

B1910

B1910

Hakko

TRANSFORMER,373

0

A1560

A1560

Hakko

HEATER,FX-8801

0

B2031

B2031

Hakko

STRAIN RELIEF,CORD,ESD,907/908/9

6

B5231

B5231

Hakko

JIG,NOZZLE,POSITIONING,FR-301

0

485-64

485-64

Hakko

JOINT,MOTOR,485

0

T0058765712N

T0058765712N

Xcelite

HEATING ELEMENT WXP 120

0

777-162

777-162

Hakko

NIPPLE,FX-901/P

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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