Accessories

Image Part Number Description / PDF Quantity Rfq
GD-100-2000N

GD-100-2000N

Xcelite

REPLACEMENT FILTER GD100

0

B2852

B2852

Hakko

SWITCH,FM-206/204/203,FX-888D/88

0

375-01

375-01

Hakko

FEEDER,SOLDER,0.5MM,375

0

BX1047

BX1047

Hakko

ASSY,PIPE GUIDE,0.5-1.0MM,HU-200

0

0622006200

0622006200

Woodhead - Molex

SOLDERING FIXTURE 10 CIR

0

777-061

777-061

Hakko

TABLE,487

0

B3402

B3402

Hakko

BUTTON,4PK,FM-203

0

B3467

B3467

Hakko

STRAIN RELIEF,CORD,FX-8801

0

T0058741716

T0058741716

Xcelite

CSF ADAPTER 011,0 DS

0

B2941

B2941

Hakko

BUTTON,SLIDE,GUN HANDLE,FM-2024

0

B1917

B1917

Hakko

HOLDER,REAR,ASSY,807

0

B3701

B3701

Hakko

FLANGE,INSULATION,FX-601

0

999-246

999-246

Hakko

HEATER,LAMP,BOTTOM IR,300W,ANTI-

0

375-02

375-02

Hakko

FEEDER,SOLDER,0.6/0.65MM,375

0

145-2002-ESDN

145-2002-ESDN

Xcelite

PARTIKELFILTER H13/GASFILTER MG1

0

B5057

B5057

Hakko

WIRE,FP PICK-UP,SS,FR-810

0

BX1053

BX1053

Hakko

TUBE UNIT,B,1.2-1.6MM,HU-200

0

B1197

B1197

Hakko

POTENTIOMETER,373/851

0

B1699

B1699

Hakko

NOZZLE,GUIDE,0.6MM,373

0

100-2003-ESDN

100-2003-ESDN

Xcelite

PARTIKLEFILTER H13/GASFILTER MG1

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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