Accessories

Image Part Number Description / PDF Quantity Rfq
B3217/P

B3217/P

Hakko

ASSY,SLEEVE,ORANGE,LOCKING,A/B,F

0

485-23

485-23

Hakko

BOX,DROSS,485

0

B3487

B3487

Hakko

CLIP,D SHAPE,FM-2027,373

0

C1540

C1540

Hakko

KIT,FUME CLIP,W/PIPE,FM-2030/202

0

A1321

A1321

Hakko

HEATER,907/908/913/914/900M/900L

0

B3486

B3486

Hakko

PIPE,GUIDE,1.2MM,FM-2027,373

0

A1178

A1178

Hakko

HEATER,45W,455

0

A5056

A5056

Hakko

HEATER,12V-140W,FR-4104

0

T0058741726

T0058741726

Xcelite

CSF D 9.3X13.0 HEAD

0

B1890

B1890

Hakko

SUPPORT,NOZZLE,373/374

0

B3419

B3419

Hakko

BUTTON,4PK,FM-205/204

0

B1056

B1056

Hakko

PLATE,FIXING,PUMP,FR-400/FM-204,

0

1910690

1910690

LOCTITE / Henkel

LOCTITE MSC 1000CUS CLEANER

0

T0058735860

T0058735860

Xcelite

FINE DUST FILTER F7 WFE2S PREFIL

0

A1554

A1554

Hakko

HEATER,LEFT SIDE,FX-301B/300

0

777-056

777-056

Hakko

SWITCH,MOTOR,487

0

B1184

B1184

Hakko

SPRING,GROUND,851/900L

0

B2289

B2289

Hakko

NUT,NIPPLE,1 EA,FX-8804,950

0

888-092

888-092

Hakko

O-RING,2PK,T8/T16 TIP,FM-2022

0

485-H-V12

485-H-V12

Hakko

HEATER,485/487

0

Accessories

1. Overview

Soldering, desoldering, and rework accessories are essential tools for electronic assembly, repair, and maintenance. These accessories enable precise joining, removal, and modification of electronic components on printed circuit boards (PCBs). Modern electronics manufacturing relies on these tools for high-precision operations in industries ranging from consumer electronics to aerospace.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Soldering Iron TipsHigh thermal conductivity, corrosion-resistant coatings, multiple geometriesPCB assembly, fine-pitch component soldering
Soldering StationsTemperature-controlled systems with modular tool integrationMass production lines, R&D prototyping
Desoldering PumpsManual/electric vacuum systems for solder removalComponent replacement, PCB repair
Hot Air Rework StationsPrecise airflow and temperature control for SMD componentsBGA reballing, QFN package replacement
Flux ApplicatorsControlled application of chemical flux for solderability enhancementPre-soldering preparation, rework processes

3. Structure and Components

Typical accessories consist of: - Heating Elements: Ceramic or carbon heating systems for rapid thermal response - Temperature Sensors: PID-controlled thermocouples for 1 C accuracy - Material Construction: Anodized aluminum housings, ESD-safe plastics - Interface Modules: Digital displays, interchangeable tool connectors - Safety Features: Overheat protection, sleep mode functions

4. Key Technical Specifications

ParameterImportance
Operating Temperature Range (100-450 C) Determines material compatibility and process window
Temperature Stability ( 2 C) Critical for solder joint quality and component safety
Heating Time (30-90s) Impacts production efficiency and thermal shock prevention
Power Consumption (20-200W) Affects operating costs and thermal management requirements
Tip Lifetime (200-2000h) Influences maintenance frequency and total ownership cost

5. Application Fields

Major industries include: - Consumer Electronics Manufacturing (smartphones, laptops) - Automotive Electronics (ECUs, sensors) - Aerospace & Defense (avionics, guidance systems) - Medical Devices (diagnostic equipment, implants) - Telecommunications Infrastructure (5G base stations, routers)

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
MetcalHX-100 SmartHeat Soldering System
WellerWSD81 Digital Soldering Station
JBCCD-2B Advanced Rework Station
HakkoFR-301 Hot Air Rework Tool
Electro-Tech SystemsAPS 925HV Selective Soldering System

7. Selection Recommendations

Key considerations: - Application type (precision vs. industrial-scale) - Compatibility with existing tooling - Temperature control requirements - ESD protection specifications - Maintenance cost and spare parts availability - Calibration requirements and traceability

8. Industry Trends

Current developments include: - Increasing adoption of AI-driven thermal profiling - Miniaturization for 01005 component handling - IoT-enabled tool monitoring systems - Lead-free soldering process optimization - Eco-friendly flux formulations - Integration with automated optical inspection (AOI)

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