Motion Sensors - Accelerometers

Image Part Number Description / PDF Quantity Rfq
MMA5224NPIKGCWR2

MMA5224NPIKGCWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA5148NDIKGWR2

MMA5148NDIKGWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA6856LKCWR2

MMA6856LKCWR2

NXP Semiconductors

ACCELEROMETER 10BIT SPI 16QFN

0

MMA5212NPIKGWR2

MMA5212NPIKGWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA6821ALKGCWR2

MMA6821ALKGCWR2

NXP Semiconductors

ACCELEROMETER 10BIT SPI 16QFN

0

MMA5112NPKGWR2

MMA5112NPKGWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

SX1533KVWT1

SX1533KVWT1

NXP Semiconductors

ACCELEROMETER

0

SX2531KVWT1

SX2531KVWT1

NXP Semiconductors

ACCELEROMETER

0

PMMA1250KEG

PMMA1250KEG

NXP Semiconductors

IC ACCEL Z-AXIS

0

PMMA1200KEG

PMMA1200KEG

NXP Semiconductors

IC ACCEL Z-AXIS 250G ROHS

0

PMMA9551LT

PMMA9551LT

NXP Semiconductors

IC ACCEL PQ38K 8533E

0

PMMA2206KEGR2

PMMA2206KEGR2

NXP Semiconductors

IC ACCEL X-LATERAL 80G

0

MMA5248LW

MMA5248LW

NXP Semiconductors

ACCELEROMETER 480G PCM/SPI 16LGA

0

PMMA2240KEGR2

PMMA2240KEGR2

NXP Semiconductors

IC ACCEL X- LATERAL 300MV G

0

PMMA1210KEG

PMMA1210KEG

NXP Semiconductors

IC ACCEL Z- AXIS 100G

0

MMA5248LWR2

MMA5248LWR2

NXP Semiconductors

ACCELEROMETER 480G PCM/SPI 16LGA

0

MMA2612KWR2

MMA2612KWR2

NXP Semiconductors

ACCELEROMETER 125G PCM 16QFN

0

MMA5106LW

MMA5106LW

NXP Semiconductors

ACCELEROMETER 60G PCM/SPI 16QFN

0

MMA5112NPIKGCWR2

MMA5112NPIKGCWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA5148LWR2

MMA5148LWR2

NXP Semiconductors

ACCELEROMETER 480G PCM/SPI 16QFN

0

Motion Sensors - Accelerometers

1. Overview

Accelerometers are motion sensors that measure acceleration forces (static or dynamic) along one or multiple axes. These devices convert mechanical motion into electrical signals, enabling quantitative analysis of vibration, tilt, shock, and dynamic movement. As core components in modern sensing systems, accelerometers play critical roles in consumer electronics, industrial automation, automotive safety systems, and aerospace navigation.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Capacitive MEMSHigh sensitivity, low power consumption, digital outputSmartphones, wearable devices
PiezoelectricSelf-powered, excellent frequency responseVibration analysis, impact detection
PiezoresistiveHigh shock tolerance, analog outputAutomotive crash testing, industrial monitoring
Servo (Force-Balance)Ultra-high precision, low noiseInertial navigation, seismic monitoring
Optical MEMSImmune to electromagnetic interferenceHigh-precision scientific instruments

3. Structure and Components

Typical accelerometers consist of: - Seismic mass with specific inertial properties - Elastic suspension elements (springs or beams) - Displacement detection circuit (capacitive, piezoelectric, or resistive) - Temperature compensation circuitry - Signal conditioning electronics - Protective housing (metal/ceramic/polymer) Modern MEMS devices integrate microstructures on silicon substrates with digital interfaces (I2C/SPI).

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement Range 2g to 500gDetermines application suitability
Resolution0.1mg to 10mgImpacts measurement precision
Frequency ResponseDC to 10kHzAffects dynamic signal capture
Nonlinearity 0.1% to 1% FSMeasurement accuracy indicator
Temperature Range-40 C to +150 CEnvironmental reliability
Power Consumption5 A to 10mABattery life consideration

5. Application Fields

  • Consumer Electronics: Smartphones (screen rotation), gaming controllers
  • Automotive: Airbag deployment, electronic stability control (ESC)
  • Industrial: Predictive maintenance systems, vibration monitoring
  • Healthcare: Fall detection devices, rehabilitation equipment
  • Aerospace: Flight control systems, structural health monitoring
  • Case Study: iPhone's ADXL345 MEMS accelerometer enables step counting and orientation detection

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Features
Analog DevicesADXL3453-axis, 13-bit resolution, I2C interface
STMicroelectronicsLSM6DSO6-axis IMU, AI-enabled edge computing
Bosch SensortecBMI270Low-power wearable sensor, 16Hz noise
TE ConnectivityKX134-1211 400g high-shock measurement
HoneywellQA-750Tactical-grade servo accelerometer

7. Selection Guidelines

  • Determine required measurement axes (1D/2D/3D)
  • Match range/sensitivity with application requirements
  • Assess environmental conditions (temperature, vibration)
  • Select appropriate output interface (analog/digital)
  • Evaluate power consumption constraints
  • Consider calibration requirements and long-term stability

8. Industry Trends

Key development directions include: - MEMS technology advancement towards atomic-scale sensitivity - Integration with gyroscopes and AI processing (smart sensors) - Wireless sensor network compatibility - Increased adoption in autonomous vehicles and IoT edge devices - Development of ultra-low-power wake-up accelerometers - Fiber optic accelerometer systems for aerospace applications - Enhanced shock survivability for industrial harsh environments

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