Motion Sensors - Accelerometers

Image Part Number Description / PDF Quantity Rfq
PMMA9550LR1

PMMA9550LR1

NXP Semiconductors

IC ACCEL 3-AXIS W/ 32-BIT MCU

0

MMA5206NDKGWR2

MMA5206NDKGWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA5212WR2

MMA5212WR2

NXP Semiconductors

ACCELEROMETER 120G 16QFN

0

MMA5124NDIKGWR2

MMA5124NDIKGWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA6811ALKGCWR2

MMA6811ALKGCWR2

NXP Semiconductors

ACCELEROMETER 10BIT SPI 16QFN

0

MMA5148NPIKWR2

MMA5148NPIKWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA6805AKGWR2

MMA6805AKGWR2

NXP Semiconductors

ACCELEROMETER 10BIT SPI 16QFN

0

MMA5212LWR2

MMA5212LWR2

NXP Semiconductors

ACCELEROMETER 120G PCM/SPI 16QFN

0

PMMA2300KEGR2

PMMA2300KEGR2

NXP Semiconductors

IC ACCEL X-AXIS 250G NOMINAL

0

SX2532PKVWT1

SX2532PKVWT1

NXP Semiconductors

ACCELEROMETER

0

MMA5248NDIKGCWR2

MMA5248NDIKGCWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA5212NPIKWR2

MMA5212NPIKWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA6210KWR2

MMA6210KWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

SX1534PKWT1

SX1534PKWT1

NXP Semiconductors

ACCELEROMETER

0

MMA5124NDIKGCWR2

MMA5124NDIKGCWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA2206KEGR2

MMA2206KEGR2

NXP Semiconductors

ACCELEROMETER 80G ANALOG 16SOIC

0

SX2532KVWT1

SX2532KVWT1

NXP Semiconductors

ACCELEROMETER

0

SX5101P4T1

SX5101P4T1

NXP Semiconductors

ACCELEROMETER

0

MMA5124LWR2

MMA5124LWR2

NXP Semiconductors

ACCELEROMETER 240G PCM/SPI 16QFN

0

MMA9550LT

MMA9550LT

NXP Semiconductors

ACCELEROMETER 2-8G I2C/SPI 16LGA

0

Motion Sensors - Accelerometers

1. Overview

Accelerometers are motion sensors that measure acceleration forces (static or dynamic) along one or multiple axes. These devices convert mechanical motion into electrical signals, enabling quantitative analysis of vibration, tilt, shock, and dynamic movement. As core components in modern sensing systems, accelerometers play critical roles in consumer electronics, industrial automation, automotive safety systems, and aerospace navigation.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Capacitive MEMSHigh sensitivity, low power consumption, digital outputSmartphones, wearable devices
PiezoelectricSelf-powered, excellent frequency responseVibration analysis, impact detection
PiezoresistiveHigh shock tolerance, analog outputAutomotive crash testing, industrial monitoring
Servo (Force-Balance)Ultra-high precision, low noiseInertial navigation, seismic monitoring
Optical MEMSImmune to electromagnetic interferenceHigh-precision scientific instruments

3. Structure and Components

Typical accelerometers consist of: - Seismic mass with specific inertial properties - Elastic suspension elements (springs or beams) - Displacement detection circuit (capacitive, piezoelectric, or resistive) - Temperature compensation circuitry - Signal conditioning electronics - Protective housing (metal/ceramic/polymer) Modern MEMS devices integrate microstructures on silicon substrates with digital interfaces (I2C/SPI).

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement Range 2g to 500gDetermines application suitability
Resolution0.1mg to 10mgImpacts measurement precision
Frequency ResponseDC to 10kHzAffects dynamic signal capture
Nonlinearity 0.1% to 1% FSMeasurement accuracy indicator
Temperature Range-40 C to +150 CEnvironmental reliability
Power Consumption5 A to 10mABattery life consideration

5. Application Fields

  • Consumer Electronics: Smartphones (screen rotation), gaming controllers
  • Automotive: Airbag deployment, electronic stability control (ESC)
  • Industrial: Predictive maintenance systems, vibration monitoring
  • Healthcare: Fall detection devices, rehabilitation equipment
  • Aerospace: Flight control systems, structural health monitoring
  • Case Study: iPhone's ADXL345 MEMS accelerometer enables step counting and orientation detection

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Features
Analog DevicesADXL3453-axis, 13-bit resolution, I2C interface
STMicroelectronicsLSM6DSO6-axis IMU, AI-enabled edge computing
Bosch SensortecBMI270Low-power wearable sensor, 16Hz noise
TE ConnectivityKX134-1211 400g high-shock measurement
HoneywellQA-750Tactical-grade servo accelerometer

7. Selection Guidelines

  • Determine required measurement axes (1D/2D/3D)
  • Match range/sensitivity with application requirements
  • Assess environmental conditions (temperature, vibration)
  • Select appropriate output interface (analog/digital)
  • Evaluate power consumption constraints
  • Consider calibration requirements and long-term stability

8. Industry Trends

Key development directions include: - MEMS technology advancement towards atomic-scale sensitivity - Integration with gyroscopes and AI processing (smart sensors) - Wireless sensor network compatibility - Increased adoption in autonomous vehicles and IoT edge devices - Development of ultra-low-power wake-up accelerometers - Fiber optic accelerometer systems for aerospace applications - Enhanced shock survivability for industrial harsh environments

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