Motion Sensors - Accelerometers

Image Part Number Description / PDF Quantity Rfq
MMA5106NPIKGCWR2

MMA5106NPIKGCWR2

NXP Semiconductors

ACCELEROMETER DSI2.5 16QFN

0

MMA6856AKGWR2

MMA6856AKGWR2

NXP Semiconductors

ACCELEROMETER 10BIT SPI 16QFN

0

MMA6821LKCWR2

MMA6821LKCWR2

NXP Semiconductors

ACCELEROMETER 10BIT SPI 16QFN

0

PMMA8205KEG

PMMA8205KEG

NXP Semiconductors

IC ACCEL X- AXIS 50G SOIC 16

0

MMA2725JW

MMA2725JW

NXP Semiconductors

ACCELEROMETER 16QFN

0

SX5100P2T1

SX5100P2T1

NXP Semiconductors

ACCELEROMETER

0

PMMA1270KEG

PMMA1270KEG

NXP Semiconductors

IC ACCEL COLOSSUS 2.5G

0

MMA5106NPKGCWR2

MMA5106NPKGCWR2

NXP Semiconductors

ACCELEROMETER DSI2.5 16QFN

0

SX2532PKWT1

SX2532PKWT1

NXP Semiconductors

ACCELEROMETER

0

PMMA1250KEGR2

PMMA1250KEGR2

NXP Semiconductors

IC ACCEL Z-AXIS

0

MMA5212NPKGCWR2

MMA5212NPKGCWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA5224NPIKGWR2

MMA5224NPIKGWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA2605KGCWR2

MMA2605KGCWR2

NXP Semiconductors

IC SENSOR ACCEL 50G X- AXIS 16QF

0

MMA5112NDIKGWR2

MMA5112NDIKGWR2

NXP Semiconductors

ACCELEROMETER PCM/SPI 16QFN

0

SX2530KWT1

SX2530KWT1

NXP Semiconductors

ACCELEROMETER

0

MMA2718JWR2

MMA2718JWR2

NXP Semiconductors

ACCELEROMETER 16QFN

0

MMA2612NKGCWR2

MMA2612NKGCWR2

NXP Semiconductors

IC SENSOR ACCELEROMETER 16QFN

0

MMA2204KEG

MMA2204KEG

NXP Semiconductors

ACCEL 112.5G ANALOG 16SOIC

0

MMA5212NDKGCWR2

MMA5212NDKGCWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

PMMA2240KEG

PMMA2240KEG

NXP Semiconductors

IC ACCEL X- LATERAL 300MV G

0

Motion Sensors - Accelerometers

1. Overview

Accelerometers are motion sensors that measure acceleration forces (static or dynamic) along one or multiple axes. These devices convert mechanical motion into electrical signals, enabling quantitative analysis of vibration, tilt, shock, and dynamic movement. As core components in modern sensing systems, accelerometers play critical roles in consumer electronics, industrial automation, automotive safety systems, and aerospace navigation.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Capacitive MEMSHigh sensitivity, low power consumption, digital outputSmartphones, wearable devices
PiezoelectricSelf-powered, excellent frequency responseVibration analysis, impact detection
PiezoresistiveHigh shock tolerance, analog outputAutomotive crash testing, industrial monitoring
Servo (Force-Balance)Ultra-high precision, low noiseInertial navigation, seismic monitoring
Optical MEMSImmune to electromagnetic interferenceHigh-precision scientific instruments

3. Structure and Components

Typical accelerometers consist of: - Seismic mass with specific inertial properties - Elastic suspension elements (springs or beams) - Displacement detection circuit (capacitive, piezoelectric, or resistive) - Temperature compensation circuitry - Signal conditioning electronics - Protective housing (metal/ceramic/polymer) Modern MEMS devices integrate microstructures on silicon substrates with digital interfaces (I2C/SPI).

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement Range 2g to 500gDetermines application suitability
Resolution0.1mg to 10mgImpacts measurement precision
Frequency ResponseDC to 10kHzAffects dynamic signal capture
Nonlinearity 0.1% to 1% FSMeasurement accuracy indicator
Temperature Range-40 C to +150 CEnvironmental reliability
Power Consumption5 A to 10mABattery life consideration

5. Application Fields

  • Consumer Electronics: Smartphones (screen rotation), gaming controllers
  • Automotive: Airbag deployment, electronic stability control (ESC)
  • Industrial: Predictive maintenance systems, vibration monitoring
  • Healthcare: Fall detection devices, rehabilitation equipment
  • Aerospace: Flight control systems, structural health monitoring
  • Case Study: iPhone's ADXL345 MEMS accelerometer enables step counting and orientation detection

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Features
Analog DevicesADXL3453-axis, 13-bit resolution, I2C interface
STMicroelectronicsLSM6DSO6-axis IMU, AI-enabled edge computing
Bosch SensortecBMI270Low-power wearable sensor, 16Hz noise
TE ConnectivityKX134-1211 400g high-shock measurement
HoneywellQA-750Tactical-grade servo accelerometer

7. Selection Guidelines

  • Determine required measurement axes (1D/2D/3D)
  • Match range/sensitivity with application requirements
  • Assess environmental conditions (temperature, vibration)
  • Select appropriate output interface (analog/digital)
  • Evaluate power consumption constraints
  • Consider calibration requirements and long-term stability

8. Industry Trends

Key development directions include: - MEMS technology advancement towards atomic-scale sensitivity - Integration with gyroscopes and AI processing (smart sensors) - Wireless sensor network compatibility - Increased adoption in autonomous vehicles and IoT edge devices - Development of ultra-low-power wake-up accelerometers - Fiber optic accelerometer systems for aerospace applications - Enhanced shock survivability for industrial harsh environments

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