Motion Sensors - Accelerometers

Image Part Number Description / PDF Quantity Rfq
MMA5212NDIKGCWR2

MMA5212NDIKGCWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

PXLS80733AESR2

PXLS80733AESR2

NXP Semiconductors

2 AXIS HI/HI YZ

0

MMA5148NDKGCWR2

MMA5148NDKGCWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA5224NPIKWR2

MMA5224NPIKWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA2612NKW

MMA2612NKW

NXP Semiconductors

IC SENSOR ACCELEROMETER 16QFN

0

PSX1507AKEGT1

PSX1507AKEGT1

NXP Semiconductors

IC ACCEL ZEUS II Z-AXIS 200G

0

PMMA1254KEG

PMMA1254KEG

NXP Semiconductors

ACCELEROMETER 5G 16SOIC

0

MMA2612NKWR2

MMA2612NKWR2

NXP Semiconductors

ACCELEROMETER 125G PCM 16QFN

0

MMA5248KWR2

MMA5248KWR2

NXP Semiconductors

ACCELEROMETER 480G PCM/SPI 16QFN

0

MMA5224LWR2

MMA5224LWR2

NXP Semiconductors

ACCELEROMETER 240G PCM/SPI 16LGA

0

PMMA2201KEG

PMMA2201KEG

NXP Semiconductors

IC ACCEL X-AXIS 50MV/G ROHS

0

MMA5212NDIKGWR2

MMA5212NDIKGWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

PMMA2300KEG

PMMA2300KEG

NXP Semiconductors

IC ACCEL X-AXIS 250G NOMINAL

0

MMA5124NPIKGCWR2

MMA5124NPIKGCWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

MMA5248NDKGCWR2

MMA5248NDKGCWR2

NXP Semiconductors

ACCELEROMETER PSI5 16QFN

0

PMMA1220KEG

PMMA1220KEG

NXP Semiconductors

IC ACCEL LOW G Z-AXIS

0

MMA5106KW

MMA5106KW

NXP Semiconductors

ACCELEROMETER 60G PCM/SPI 16QFN

0

SX5101P1T1

SX5101P1T1

NXP Semiconductors

ACCELEROMETER

0

SX5212P1KWT1

SX5212P1KWT1

NXP Semiconductors

ACCELEROMETER

0

SX5100P3KT1

SX5100P3KT1

NXP Semiconductors

ACCELEROMETER

0

Motion Sensors - Accelerometers

1. Overview

Accelerometers are motion sensors that measure acceleration forces (static or dynamic) along one or multiple axes. These devices convert mechanical motion into electrical signals, enabling quantitative analysis of vibration, tilt, shock, and dynamic movement. As core components in modern sensing systems, accelerometers play critical roles in consumer electronics, industrial automation, automotive safety systems, and aerospace navigation.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Capacitive MEMSHigh sensitivity, low power consumption, digital outputSmartphones, wearable devices
PiezoelectricSelf-powered, excellent frequency responseVibration analysis, impact detection
PiezoresistiveHigh shock tolerance, analog outputAutomotive crash testing, industrial monitoring
Servo (Force-Balance)Ultra-high precision, low noiseInertial navigation, seismic monitoring
Optical MEMSImmune to electromagnetic interferenceHigh-precision scientific instruments

3. Structure and Components

Typical accelerometers consist of: - Seismic mass with specific inertial properties - Elastic suspension elements (springs or beams) - Displacement detection circuit (capacitive, piezoelectric, or resistive) - Temperature compensation circuitry - Signal conditioning electronics - Protective housing (metal/ceramic/polymer) Modern MEMS devices integrate microstructures on silicon substrates with digital interfaces (I2C/SPI).

4. Key Technical Specifications

ParameterDescriptionImportance
Measurement Range 2g to 500gDetermines application suitability
Resolution0.1mg to 10mgImpacts measurement precision
Frequency ResponseDC to 10kHzAffects dynamic signal capture
Nonlinearity 0.1% to 1% FSMeasurement accuracy indicator
Temperature Range-40 C to +150 CEnvironmental reliability
Power Consumption5 A to 10mABattery life consideration

5. Application Fields

  • Consumer Electronics: Smartphones (screen rotation), gaming controllers
  • Automotive: Airbag deployment, electronic stability control (ESC)
  • Industrial: Predictive maintenance systems, vibration monitoring
  • Healthcare: Fall detection devices, rehabilitation equipment
  • Aerospace: Flight control systems, structural health monitoring
  • Case Study: iPhone's ADXL345 MEMS accelerometer enables step counting and orientation detection

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Features
Analog DevicesADXL3453-axis, 13-bit resolution, I2C interface
STMicroelectronicsLSM6DSO6-axis IMU, AI-enabled edge computing
Bosch SensortecBMI270Low-power wearable sensor, 16Hz noise
TE ConnectivityKX134-1211 400g high-shock measurement
HoneywellQA-750Tactical-grade servo accelerometer

7. Selection Guidelines

  • Determine required measurement axes (1D/2D/3D)
  • Match range/sensitivity with application requirements
  • Assess environmental conditions (temperature, vibration)
  • Select appropriate output interface (analog/digital)
  • Evaluate power consumption constraints
  • Consider calibration requirements and long-term stability

8. Industry Trends

Key development directions include: - MEMS technology advancement towards atomic-scale sensitivity - Integration with gyroscopes and AI processing (smart sensors) - Wireless sensor network compatibility - Increased adoption in autonomous vehicles and IoT edge devices - Development of ultra-low-power wake-up accelerometers - Fiber optic accelerometer systems for aerospace applications - Enhanced shock survivability for industrial harsh environments

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