RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
4202PA51H01200

4202PA51H01200

Laird - Performance Materials

GK NICU PTAFG PU V0 DSH

0

4181PA51G09600

4181PA51G09600

Laird - Performance Materials

GK NICU NRSG PU V0 DSH

0

4246PA51G01800

4246PA51G01800

Laird - Performance Materials

GK,NICU,NRSG,PU,V0,REC

0

4520PA51H01200

4520PA51H01200

Laird - Performance Materials

GK NICU PTAFG PU V0 SQ

0

0097055508

0097055508

Laird - Performance Materials

TWT,STR,SNSAT,PSA

0

29100011

29100011

Laird - Performance Materials

CA19/PSA A11658

0

0097077817

0097077817

Laird - Performance Materials

DCON,9P,SNB

0

4184PA51G01181

4184PA51G01181

Laird - Performance Materials

GK NICU NRSG PU V0 DSH

0

4502AB22100580

4502AB22100580

Laird - Performance Materials

GK NICU PTAF TPE HB REC

0

4228PA51H04800

4228PA51H04800

Laird - Performance Materials

GK NICU PTAFG PU V0 DSH

0

0097048802

0097048802

Laird - Performance Materials

BATCON,PCS,BF

0

4E06PA51H01800

4E06PA51H01800

Laird - Performance Materials

GK,NICU,PTAFG,PU,V0,TRI

0

0097052005

0097052005

Laird - Performance Materials

AP,STR,CDY,PSA .140X.370X.250X16

0

0097015419

0097015419

Laird - Performance Materials

CSTR,MRG,NIB

0

4692PA51H09600

4692PA51H09600

Laird - Performance Materials

GK NICU PTAFG PU V0 DSH

0

4520AB51K00571

4520AB51K00571

Laird - Performance Materials

GK NICU NRS PU V0 SQ

0

8907-0116-42

8907-0116-42

Laird - Performance Materials

EGW,MON 6.4X6.1X9.5MM

0

4245PA51H01200

4245PA51H01200

Laird - Performance Materials

GK NICU PTAFG PU V0 REC

0

4692PA51G00200

4692PA51G00200

Laird - Performance Materials

GK NICU NRSG PU V0 DSH

0

0097065617

0097065617

Laird - Performance Materials

PCLIP,STR,SNB,CLO

0

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
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