RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
4695PA51H01200

4695PA51H01200

Laird - Performance Materials

GK NICU PTAFG PU V0 SQ

0

0097078116

0097078116

Laird - Performance Materials

DCON,37P,ZNY

0

4094PA51H00079

4094PA51H00079

Laird - Performance Materials

GK NICU PTAFG PU V0 REC

0

0097044017N00254

0097044017N00254

Laird - Performance Materials

CSTR,PCS,SNB,CTL .353X1.978X.500

0

4612AB51K00472

4612AB51K00472

Laird - Performance Materials

GK NICU NRS PU V0 REC

0

4649PA51G01800

4649PA51G01800

Laird - Performance Materials

GK,NICU,NRSG,PU,V0,REC

0

4D17EA51K00214

4D17EA51K00214

Laird - Performance Materials

IO NICU NRS PU V0 REC

0

4226AB50109600

4226AB50109600

Laird - Performance Materials

GK NICU PTAF PU NR REC

0

0097036021

0097036021

Laird - Performance Materials

CSTR,STR,SU

0

0C97044017

0C97044017

Laird - Performance Materials

CSTR COIL SNB

0

0098037002

0098037002

Laird - Performance Materials

CSTR,STR,BF,USFT

0

0097048918

0097048918

Laird - Performance Materials

BATCON,NIE

0

4650AB51K04800

4650AB51K04800

Laird - Performance Materials

GK NICU NRS PU V0 REC

0

0097062117

0097062117

Laird - Performance Materials

CLO,STR,SNB,TLN

0

4223PA51H03600

4223PA51H03600

Laird - Performance Materials

GK NICU PTAFG PU V0 REC

0

4696AB22104800

4696AB22104800

Laird - Performance Materials

GK NICU PTAF TPE HB CSH

0

0097042119

0097042119

Laird - Performance Materials

CSTR,FRG,NIB

0

4283PA51H01200

4283PA51H01200

Laird - Performance Materials

GK NICU PTAFG PU V0 DSH

0

4134PA51H08400

4134PA51H08400

Laird - Performance Materials

GK NICU PTAFG PU V0 DSH

0

4211AB51K00575

4211AB51K00575

Laird - Performance Materials

GK NICU NRS PU V0 REC

0

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
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