RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
4098PA51H01200

4098PA51H01200

Laird - Performance Materials

GK NICU PTAFG PU V0 REC

0

1000003266

1000003266

Laird - Performance Materials

BLS,9720,FEN,SNB,LP .214X1.219X1

0

4239PA51H01200

4239PA51H01200

Laird - Performance Materials

GK NICU PTAFG PU V0 REC

0

4188AC51H03600

4188AC51H03600

Laird - Performance Materials

GK NICU PTAFG PU V0 REC

0

8560-0413-93

8560-0413-93

Laird - Performance Materials

DIECUT ECE093

0

0097015418

0097015418

Laird - Performance Materials

CSTR,MRG,NIE

0

8508-0592-56

8508-0592-56

Laird - Performance Materials

EMOW SILSD MON DC

0

8639008174

8639008174

Laird - Performance Materials

VPEDF,REC ,#8639,CRY 3.2X252.5X4

0

0078001002

0078001002

Laird - Performance Materials

SLMT,STR,BF,USF

0

8868-0115-72

8868-0115-72

Laird - Performance Materials

CHSTR,CUSTMATL 3.96X3.96X1.57X1.

0

8506003855

8506003855

Laird - Performance Materials

ENSL,SILSP,MON,FRM 8.060X13.130

0

4198ADH1K00260

4198ADH1K00260

Laird - Performance Materials

GK NICU NRS PU V0 CSH

0

0098055102

0098055102

Laird - Performance Materials

TWT,STR,BF,USFT,PSA

0

4701PA51G01550

4701PA51G01550

Laird - Performance Materials

GK,NICU,NRSG,PU,V0,REC .250X.375

0

0097095418

0097095418

Laird - Performance Materials

S3,STR,NIE,PSA

0

0097036008

0097036008

Laird - Performance Materials

CSTR,PCS,SNSAT

0

4633PA51H00100

4633PA51H00100

Laird - Performance Materials

GK NICU PTAFG PU V0 BELL

0

4273AE51H01663

4273AE51H01663

Laird - Performance Materials

GK NICU PTAFG PU V0 REC

0

4228PA51H00400

4228PA51H00400

Laird - Performance Materials

GK NICU PTAFG PU V0 DSH

0

1A0127R0200

1A0127R0200

Laird - Performance Materials

HFR,NICU,NRS,CPSA,RL 12.7MMX20.0

0

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
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