RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
8516-0156-56

8516-0156-56

Laird - Performance Materials

MILCONNECTOR,MIM613 31.8X27X24.6

0

1A0100R0200

1A0100R0200

Laird - Performance Materials

HFR,NICU,NRS,CPSA,RL 10.0MMX20.0

0

4697PAH1K01200

4697PAH1K01200

Laird - Performance Materials

GK NICU NRS PU V0 CSH

0

8300-0100-44

8300-0100-44

Laird - Performance Materials

ELECTROMESH TAPE

0

4602PA51G01800

4602PA51G01800

Laird - Performance Materials

GK,NICU,NRSG,PU,V0,REC

0

0098055002

0098055002

Laird - Performance Materials

TWT,STR,BF,USF,PSA

0

4609PA51G00334

4609PA51G00334

Laird - Performance Materials

GK NICU NRSG PU V0 DSH

0

4379AB51K09600

4379AB51K09600

Laird - Performance Materials

GK NICU NRS PU V0 BELL

0

0097054217

0097054217

Laird - Performance Materials

NOSG,STR,SNB,PSA

0

4388AE51G01450

4388AE51G01450

Laird - Performance Materials

GK NICU NRSG PU V0 DSH

0

8101010340

8101010340

Laird - Performance Materials

UFR,BECU,BF,RL 0.125IN

0

0097038018

0097038018

Laird - Performance Materials

CSTR,STR,NIE

0

4741AB51K00242

4741AB51K00242

Laird - Performance Materials

GK NICU NRS PU V0 REC

0

0097056049

0097056049

Laird - Performance Materials

TWT,STR,NIB

0

0078005719

0078005719

Laird - Performance Materials

VSLMT,STR,NIB,USFT

0

M83528/001D002

M83528/001D002

Laird - Performance Materials

OSTRSD,ECE126 1.35MM

0

4220AB51K02800

4220AB51K02800

Laird - Performance Materials

GK NICU NRS PU V0 REC

0

4697AB22100106

4697AB22100106

Laird - Performance Materials

GK NICU PTAF TPE HB CSH

0

0097044002

0097044002

Laird - Performance Materials

CSTR,STR,BF

0

4694PA51H01200

4694PA51H01200

Laird - Performance Materials

GK NICU PTAFG PU V0 REC

0

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
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