RFI and EMI - Contacts, Fingerstock and Gaskets

Image Part Number Description / PDF Quantity Rfq
0C97054217

0C97054217

Laird - Performance Materials

NOSG COIL SNB PSA

0

4AP6PAH1K09600

4AP6PAH1K09600

Laird - Performance Materials

EMI GASKET W/ADHESIVE BACKING

0

8866-0136-81

8866-0136-81

Laird - Performance Materials

DSTRHOL,ECE081 4.1X3.0X2.0X0.6MM

0

4798AB51K09600

4798AB51K09600

Laird - Performance Materials

GK NICU NRS PU V0 REC

0

4575EB51Y00501

4575EB51Y00501

Laird - Performance Materials

IO NICU MESH PU V0 REC

0

4A66PA51H09600

4A66PA51H09600

Laird - Performance Materials

GK NICU PTAFG PU V0 BELL

0

1A0250R0200

1A0250R0200

Laird - Performance Materials

HFR,NICU,NRS,CPSA,RL 25.0MMX20.0

0

0077005616

0077005616

Laird - Performance Materials

VSLMT,STR,ZNY

0

4569AB01H03937

4569AB01H03937

Laird - Performance Materials

01H FOF GASKET, RETANGULAR, 0.5M

468

4240PA51H01200

4240PA51H01200

Laird - Performance Materials

GK NICU PTAFG PU V0 DSH

0

8679071470

8679071470

Laird - Performance Materials

VPE,REC,#8679,CRY 9.5X209.6X387.

0

4228PA51G09600

4228PA51G09600

Laird - Performance Materials

GK NICU NRSG PU V0 DSH

0

4693AB51H01800

4693AB51H01800

Laird - Performance Materials

GK NICU PTAFG PU V0 REC

0

0097078017

0097078017

Laird - Performance Materials

DCON,25P,SNB

0

0077006217

0077006217

Laird - Performance Materials

SLMT,1F,SNB

0

4090PA51H01200

4090PA51H01200

Laird - Performance Materials

GK NICU PTAFG PU V0 DSH

0

0077007119

0077007119

Laird - Performance Materials

NOSG,STR,NIB,PSA

0

4131PA51G00800

4131PA51G00800

Laird - Performance Materials

GK NICU NRSG PU V0 BELL

0

4117AB51G09600

4117AB51G09600

Laird - Performance Materials

GK,NICU,NRSG,PU,V0,JSH .130X.130

0

4795PA51H01535

4795PA51H01535

Laird - Performance Materials

GK NICU PTAFG PU V0 REC

0

RFI and EMI - Contacts, Fingerstock and Gaskets

1. Overview

RF/IF (Radio Frequency/Intermediate Frequency) and RFID (Radio Frequency Identification) systems require effective electromagnetic interference (EMI) and radio frequency interference (RFI) shielding to maintain signal integrity. Contacts, fingerstock, and gaskets are critical components for ensuring electrical continuity and shielding performance in electronic enclosures. These components prevent electromagnetic leakage while maintaining mechanical functionality in connectors, housings, and assemblies.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
ContactsConductive elements for maintaining electrical connections under compressionRF connectors, PCB grounding pads
FingerstockResilient metal strips with finger-like projections for continuous shieldingServer chassis, military equipment
GasketsConductive elastomers or mesh materials for sealing gapsAutomotive sensors, medical devices

3. Structure and Composition

Typical structures include:

  • Contacts: Beryllium copper or phosphor bronze cores with conductive platings (gold, silver, nickel)
  • Fingerstock: Canted coil springs or stamped metal fingers with corrosion-resistant coatings
  • Gaskets: Silicone rubber with embedded silver-aluminum particles or wire mesh

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance0.1-10 m Affects signal transmission efficiency
Shielding Effectiveness60-120 dB (100 MHz-10 GHz)Determines EMI/RFI attenuation
Compression Force0.5-5 N/mmImpacts mechanical durability
Temperature Range-55 C to +150 CDefines operational stability

5. Application Fields

Main industries include:

  • Telecommunications (5G base stations, microwave links)
  • Automotive (V2X communication systems, radar sensors)
  • Aerospace (avionics shielding compartments)
  • Medical (MRI shielding enclosures)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Parker ChomericsCHO-SEAL conductive gaskets
Laird Performance MaterialsForm-in-Place EMI gaskets
3MEMI Shielding Tapes 9703/9706
SamtecRFI/EMI shielded connectors

7. Selection Recommendations

Considerations include:

  • Frequency range of the application (higher frequencies require tighter tolerances)
  • Environmental conditions (temperature, humidity, chemical exposure)
  • Material compatibility (avoid galvanic corrosion between mating surfaces)
  • Cost-effectiveness (balance performance vs. budget constraints)

Case Study: In automotive radar systems, Parker Chomerics' silicone-based gaskets reduced EMI leakage by 40% compared to traditional metal fingerstock.

8. Industry Trends

Key development directions:

  • Miniaturization for 5G mmWave applications
  • Low-PIM (Passive Intermodulation) material formulations
  • Multi-functional integration with thermal management
  • RoHS-compliant plating processes (eliminating hexavalent chromium)
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