Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-V4V7R5JV Panasonic	RES ARRAY 2 RES 7.5 OHM 0606	9850
EXB-V4V433JV Panasonic	RES ARRAY 2 RES 43K OHM 0606	0
EXB-24V5R6JX Panasonic	RES ARRAY 2 RES 5.6 OHM 0404	27667
EXB-E10C332J Panasonic	RES ARRAY 8 RES 3.3K OHM 1608	7815
EXB-28V1R8JX Panasonic	RES ARRAY 4 RES 1.8 OHM 0804	10000
EXB-38V203JV Panasonic	RES ARRAY 4 RES 20K OHM 1206	0
EXB-34V113JV Panasonic	RES ARRAY 2 RES 11K OHM 0606	0
EXB-24V300JX Panasonic	RES ARRAY 2 RES 30 OHM 0404	0
EXB-18V332JX Panasonic	RES ARRAY 4 RES 3.3K OHM 0502	12322
EXB-38V302JV Panasonic	RES ARRAY 4 RES 3K OHM 1206	0
EXB-18V120JX Panasonic	RES ARRAY 4 RES 12 OHM 0502	26280
EXB-2HV330JV Panasonic	RES ARRAY 8 RES 33 OHM 1506	143501
EXB-28N3R0JX Panasonic	RES ARRAY 4 RES 3 OHM 0804	29000
EXB-V8V474JV Panasonic	RES ARRAY 4 RES 470K OHM 1206	19815
EXB-E10C562J Panasonic	RES ARRAY 8 RES 5.6K OHM 1608	1425
EXB-28V103JX Panasonic	RES ARRAY 4 RES 10K OHM 0804	153410
EXB-38V681JV Panasonic	RES ARRAY 4 RES 680 OHM 1206	1020
EXB-14V822JX Panasonic	RES ARRAY 2 RES 8.2K OHM 0302	10000
EXB-34V471JV Panasonic	RES ARRAY 2 RES 470 OHM 0606	49735
EXB-A10P153J Panasonic	RES ARRAY 8 RES 15K OHM 2512	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages