Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-38V682JV Panasonic	RES ARRAY 4 RES 6.8K OHM 1206	32449
EXB-V4V473JV Panasonic	RES ARRAY 2 RES 47K OHM 0606	37267
EXB-Q16P153J Panasonic	RES ARRAY 15 RES 15K OHM 1506	2159
EXB-N8V150JX Panasonic	RES ARRAY 4 RES 15 OHM 0804	16388
EXB-V4V271JV Panasonic	RES ARRAY 2 RES 270 OHM 0606	20000
EXB-38V1R0JV Panasonic	RES ARRAY 4 RES 1 OHM 1206	6978
EXB-34V684JV Panasonic	RES ARRAY 2 RES 680K OHM 0606	0
EXB-14V473JX Panasonic	RES ARRAY 2 RES 47K OHM 0302	12760
EXB-F6E823G Panasonic	RES ARRAY 5 RES 82K OHM 6SIP	1569
EXB-24V392JX Panasonic	RES ARRAY 2 RES 3.9K OHM 0404	2035
EXB-V4V913JV Panasonic	RES ARRAY 2 RES 91K OHM 0606	0
EXB-28V332JX Panasonic	RES ARRAY 4 RES 3.3K OHM 0804	19985
EXB-A10P271J Panasonic	RES ARRAY 8 RES 270 OHM 2512	18621
EXB-28V4R7JX Panasonic	RES ARRAY 4 RES 4.7 OHM 0804	19190
EXB-14V684JX Panasonic	RES ARRAY 2 RES 680K OHM 0302	0
EXB-38V2R7JV Panasonic	RES ARRAY 4 RES 2.7 OHM 1206	0
EXB-34V302JV Panasonic	RES ARRAY 2 RES 3K OHM 0606	0
EXB-34V122JV Panasonic	RES ARRAY 2 RES 1.2K OHM 0606	57
EXB-V4V911JV Panasonic	RES ARRAY 2 RES 910 OHM 0606	0
EXB-34V434JV Panasonic	RES ARRAY 2 RES 430K OHM 0606	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages