Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-A10P561J Panasonic	RES ARRAY 8 RES 560 OHM 2512	0
EXB-U28390JX Panasonic	RES ARRAY 4 RES 39 OHM 0804	18615
EXB-34V202JV Panasonic	RES ARRAY 2 RES 2K OHM 0606	0
EXB-24V8R2JX Panasonic	RES ARRAY 2 RES 8.2 OHM 0404	16953
EXB-V8V271JV Panasonic	RES ARRAY 4 RES 270 OHM 1206	30815
EXB-14V390JX Panasonic	RES ARRAY 2 RES 39 OHM 0302	22696
EXB-F10E334G Panasonic	RES ARRAY 9 RES 330K OHM 10SIP	444
EXB-E10C183J Panasonic	RES ARRAY 8 RES 18K OHM 1608	23594
EXB-38V3R0JV Panasonic	RES ARRAY 4 RES 3 OHM 1206	44370
EXB-28V394JX Panasonic	RES ARRAY 4 RES 390K OHM 0804	7980
EXB-N8V622JX Panasonic	RES ARRAY 4 RES 6.2K OHM 0804	9077
EXB-28V751JX Panasonic	RES ARRAY 4 RES 750 OHM 0804	21154
EXB-38V434JV Panasonic	RES ARRAY 4 RES 430K OHM 1206	0
EXB-V8V563JV Panasonic	RES ARRAY 4 RES 56K OHM 1206	5000
EXB-V8V624JV Panasonic	RES ARRAY 4 RES 620K OHM 1206	0
EXB-V8V105JV Panasonic	RES ARRAY 4 RES 1M OHM 1206	2243
EXB-28VR000X Panasonic	RES ARRAY 4 RES ZERO OHM 0804	159331
EXB-N8V562JX Panasonic	RES ARRAY 4 RES 5.6K OHM 0804	29884
EXB-34V161JV Panasonic	RES ARRAY 2 RES 160 OHM 0606	0
EXB-34V432JV Panasonic	RES ARRAY 2 RES 4.3K OHM 0606	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages