Arrays/Networks Resistors

Part Number	Description / PDF	Quantity
EXB-24V160JX Panasonic	RES ARRAY 2 RES 16 OHM 0404	0
EXB-N8V273JX Panasonic	RES ARRAY 4 RES 27K OHM 0804	759
EXB-24V100JX Panasonic	RES ARRAY 2 RES 10 OHM 0404	48600
EXB-Q16P472J Panasonic	RES ARRAY 15 RES 4.7K OHM 1506	0
EXB-V4V562JV Panasonic	RES ARRAY 2 RES 5.6K OHM 0606	11989
EXB-N8V680JX Panasonic	RES ARRAY 4 RES 68 OHM 0804	65857
EXB-38V100JV Panasonic	RES ARRAY 4 RES 10 OHM 1206	67722
EXB-V8V362JV Panasonic	RES ARRAY 4 RES 3.6K OHM 1206	0
EXB-34V110JV Panasonic	RES ARRAY 2 RES 11 OHM 0606	0
EXB-38V152JV Panasonic	RES ARRAY 4 RES 1.5K OHM 1206	17410
EXB-V4V110JV Panasonic	RES ARRAY 2 RES 11 OHM 0606	0
EXB-V8V132JV Panasonic	RES ARRAY 4 RES 1.3K OHM 1206	0
EXB-38V913JV Panasonic	RES ARRAY 4 RES 91K OHM 1206	0
EXB-24V6R2JX Panasonic	RES ARRAY 2 RES 6.2 OHM 0404	29630
EXB-2HV432JV Panasonic	RES ARRAY 8 RES 4.3K OHM 1506	0
EXB-V8V7R5JV Panasonic	RES ARRAY 4 RES 7.5 OHM 1206	1490
EXB-38V153JV Panasonic	RES ARRAY 4 RES 15K OHM 1206	44401
EXB-2HV201JV Panasonic	RES ARRAY 8 RES 200 OHM 1506	0
EXB-D10C332J Panasonic	RES ARRAY 8 RES 3.3K OHM 1206	6646
EXB-V4V684JV Panasonic	RES ARRAY 2 RES 680K OHM 0606	0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Bussed Resistor Arrays	Common terminal connection for multiple resistors	Digital logic pull-up/pull-down networks
Isolated Resistor Networks	Electrically separated resistor elements	Analog signal conditioning circuits
Voltage Divider Arrays	Precisely matched resistor ratios	Sensor signal scaling in measurement systems
Termination Networks	High-precision impedance matching	High-speed data bus termination
Integrated EMI Filters	Combined resistive and capacitive elements	Noise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

Ceramic substrate (Al O or AlN) for thermal stability
Thin-film or thick-film resistive elements (NiCr, TaN)
Termination pads with Ag/Pd or Sn/Pb metallization
Molded epoxy encapsulation (for discrete packages)
Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

Parameter	Significance
Resistance Range	0.1 to 10M (determines application suitability)
Power Rating	50mW to 1W per element (thermal management factor)
Tolerance	0.1% to 5% (precision level indicator)
TCR	25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance	100M min (isolation performance)
Voltage Rating	50V to 200V (safety and breakdown protection)

5. Application Fields

Consumer Electronics: Smartphones (LCD biasing), IoT devices
Automotive: ECU sensor interfaces, LED lighting control
Industrial: PLC signal conditioning, precision instrumentation
Telecommunications: Transmission line termination, RF circuits
Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

Manufacturer	Key Products
Vishay Precision Group	CRCW-HP series (high-precision thin-film)
Panasonic Electronic Devices	EX-H series (automotive-grade networks)
TT Electronics	WSL series (low-TCR power arrays)
ROHM Semiconductor	MNR series (miniaturized resistor networks)
Yageo Corporation	RCN series (high-voltage termination arrays)

7. Selection Guidelines

Calculate required resistance values and tolerances
Determine power dissipation requirements per element
Assess temperature coefficient needs based on operating environment
Select package type compatible with PCB layout and assembly process
Consider EMI filtering requirements for high-frequency applications
Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

Miniaturization: 01005-inch footprint arrays for mobile devices
Increased integration: Embedded passives in SiP modules
Extended reliability: AEC-Q100 qualified parts for EV systems
High-precision manufacturing: Laser-trimmed thin-film technology
Environmental compliance: Halogen-free and RoHS-compliant packages