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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RAVF164DFT2K00

RAVF164DFT2K00

Stackpole Electronics, Inc.

RES ARRAY 4 RES 2K OHM 1206

0
RAVF164DJT15R0

RAVF164DJT15R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 15 OHM 1206

0
RAVF168DJT4K70

RAVF168DJT4K70

Stackpole Electronics, Inc.

RES ARRAY 8 RES 4.7K OHM 1506

0
RAVF164DJT2R40

RAVF164DJT2R40

Stackpole Electronics, Inc.

RES ARRAY 4 RES 2.4 OHM 1206

0
RAVF102DJT15R0

RAVF102DJT15R0

Stackpole Electronics, Inc.

RES ARRAY 2 RES 15 OHM 0404

0
RAVF104DFT3K30

RAVF104DFT3K30

Stackpole Electronics, Inc.

RES ARRAY 4 RES 3.3K OHM 0804

0
RACF324DJT22K0

RACF324DJT22K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 22K OHM 2010

1195
RACF324DJT560R

RACF324DJT560R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 560 OHM 2010

0
RAVF164DJT39K0

RAVF164DJT39K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 39K OHM 1206

0
RAVF324DJT82R0

RAVF324DJT82R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 82 OHM 2012

4000
RAVF162DJT27R0

RAVF162DJT27R0

Stackpole Electronics, Inc.

RES ARRAY 2 RES 27 OHM 0606

0
RAVF052DJT100R

RAVF052DJT100R

Stackpole Electronics, Inc.

RES ARRAY 2 RES 510 OHM 0302

0
RAVF164DFT180R

RAVF164DFT180R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 180 OHM 1206

0
RAVF104DGT39R0

RAVF104DGT39R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 39 OHM 0804

0
RAVF164DJT330K

RAVF164DJT330K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 330K OHM 1206

0
RAVF162DJT11K0

RAVF162DJT11K0

Stackpole Electronics, Inc.

RES ARRAY 2 RES 11K OHM 0606

0
RAVF164DJT8K20

RAVF164DJT8K20

Stackpole Electronics, Inc.

RES ARRAY 4 RES 8.2K OHM 1206

0
RAVF164DJT220R

RAVF164DJT220R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 220 OHM 1206

7152
RAVF104DJT3K30

RAVF104DJT3K30

Stackpole Electronics, Inc.

RES ARRAY 4 RES 3.3K OHM 0804

0
RAVF102DFT22R0

RAVF102DFT22R0

Stackpole Electronics, Inc.

RES ARRAY 2 RES 22 OHM 0404

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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