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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RAVF164DFT11R0

RAVF164DFT11R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 11 OHM 1206

0
RAVF104DJT3K00

RAVF104DJT3K00

Stackpole Electronics, Inc.

RES ARRAY 4 RES 3K OHM 0804

0
RAVF104DFT56K0

RAVF104DFT56K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 56K OHM 0804

0
RAVF164DJT1R50

RAVF164DJT1R50

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.5 OHM 1206

0
RAVF104DFT470K

RAVF104DFT470K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 470K OHM 0804

0
RAVF104DFT4K70

RAVF104DFT4K70

Stackpole Electronics, Inc.

RES ARRAY 4 RES 4.7K OHM 0804

0
RAVF328RJT2K20

RAVF328RJT2K20

Stackpole Electronics, Inc.

RES ARRAY 8 RES 2.2K OHM 1206

0
RACF164DGT10K0

RACF164DGT10K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 10K OHM 1206

0
RAVF164DJT3K60

RAVF164DJT3K60

Stackpole Electronics, Inc.

RES ARRAY 4 RES 3.6K OHM 1206

0
RAVF162DJT1K10

RAVF162DJT1K10

Stackpole Electronics, Inc.

RES ARRAY 2 RES 1.1K OHM 0606

0
RAVF104DJT22R0

RAVF104DJT22R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 22 OHM 0804

2147483647
RAVF164DFT20K0

RAVF164DFT20K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 20K OHM 1206

0
RAVF328RJT47K0

RAVF328RJT47K0

Stackpole Electronics, Inc.

RES ARRAY 8 RES 47K OHM 1206

0
RAVF164DJT62K0

RAVF164DJT62K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 62K OHM 1206

0
RAVF104DJT2K20

RAVF104DJT2K20

Stackpole Electronics, Inc.

RES ARRAY 4 RES 2.2K OHM 0804

0
RAVF164DJT3R90

RAVF164DJT3R90

Stackpole Electronics, Inc.

RES ARRAY 4 RES 3.9 OHM 1206

0
RAVF328RJT1M00

RAVF328RJT1M00

Stackpole Electronics, Inc.

RES ARRAY 8 RES 1M OHM 1206

0
RAVF102DJT51R0

RAVF102DJT51R0

Stackpole Electronics, Inc.

RES ARRAY 2 RES 51 OHM 0404

0
RAVF324DJT120K

RAVF324DJT120K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 120 OHM 2012

0
RAVF164DJT510R

RAVF164DJT510R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 510 OHM 1206

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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