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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RAVF104DJT91R0

RAVF104DJT91R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 91 OHM 0804

0
RAVF168DJT2K20

RAVF168DJT2K20

Stackpole Electronics, Inc.

RES ARRAY 8 RES 2.2K OHM 1506

0
RAVF164DFT1K30

RAVF164DFT1K30

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.3K OHM 1206

0
RAVF104DJT2R00

RAVF104DJT2R00

Stackpole Electronics, Inc.

RES ARRAY 4 RES 2 OHM 0804

0
RAVF164DFT26R7

RAVF164DFT26R7

Stackpole Electronics, Inc.

RES ARRAY 4 RES 26.7 OHM 1206

0
RAVF164DJT4R30

RAVF164DJT4R30

Stackpole Electronics, Inc.

RES ARRAY 4 RES 4.3 OHM 1206

0
RAVF104DJT3R60

RAVF104DJT3R60

Stackpole Electronics, Inc.

RES ARRAY 4 RES 3.6 OHM 0804

0
RAVF162DJT910R

RAVF162DJT910R

Stackpole Electronics, Inc.

RES ARRAY 2 RES 910 OHM 0606

0
RAVF104DJT160R

RAVF104DJT160R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 160 OHM 0804

0
RAVF164DZT0R00

RAVF164DZT0R00

Stackpole Electronics, Inc.

RES ARRAY 4 RES ZERO OHM 1206

10469
RAVF164DFT39K0

RAVF164DFT39K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 39K OHM 1206

0
RAVF164DFT120R

RAVF164DFT120R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 120 OHM 1206

0
RAVF324DJT3K30

RAVF324DJT3K30

Stackpole Electronics, Inc.

RES ARRAY 4 RES 3.3K OHM 2012

0
RAVF104DJT330R

RAVF104DJT330R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 330 OHM 0804

0
RAVF162DJT4K30

RAVF162DJT4K30

Stackpole Electronics, Inc.

RES ARRAY 2 RES 4.3K OHM 0606

0
RAVF102DJT18R0

RAVF102DJT18R0

Stackpole Electronics, Inc.

RES ARRAY 2 RES 18 OHM 0404

0
RAVF168DJT1K00

RAVF168DJT1K00

Stackpole Electronics, Inc.

RES ARRAY 8 RES 1K OHM 1506

0
RAVF104DZT0R00

RAVF104DZT0R00

Stackpole Electronics, Inc.

RES ARRAY 4 RES ZERO OHM 0804

5625
RAVF164DFT300K

RAVF164DFT300K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 300K OHM 1206

0
RAVF164DFT6K20

RAVF164DFT6K20

Stackpole Electronics, Inc.

RES ARRAY 4 RES 6.2K OHM 1206

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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