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Arrays/Networks Resistors

Image Part Number Description / PDF Quantity Rfq
RAVF164DJT680R

RAVF164DJT680R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 680 OHM 1206

0
RAVF104DJT1K20

RAVF104DJT1K20

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.2K OHM 0804

0
RAVF324DJT6K80

RAVF324DJT6K80

Stackpole Electronics, Inc.

RES ARRAY 4 RES 6.8K OHM 2012

0
RAVF104DJT180R

RAVF104DJT180R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 180 OHM 0804

0
RAVF164DFT3K30

RAVF164DFT3K30

Stackpole Electronics, Inc.

RES ARRAY 4 RES 3.3K OHM 1206

5000
RAVF164DJT3K00

RAVF164DJT3K00

Stackpole Electronics, Inc.

RES ARRAY 4 RES 3K OHM 1206

0
RAVF104DFT91K0

RAVF104DFT91K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 91K OHM 0804

0
RAVF102DJT100R

RAVF102DJT100R

Stackpole Electronics, Inc.

RES ARRAY 2 RES 100 OHM 0404

0
RAVF104DFT47R0

RAVF104DFT47R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 47 OHM 0804

0
RAVF104DFT1K60

RAVF104DFT1K60

Stackpole Electronics, Inc.

RES ARRAY 4 RES 1.6K OHM 0804

0
RAVF104DJT62R0

RAVF104DJT62R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 62 OHM 0804

0
RAVF104DJT5K60

RAVF104DJT5K60

Stackpole Electronics, Inc.

RES ARRAY 4 RES 5.6K OHM 0804

0
RAVF104DJT130R

RAVF104DJT130R

Stackpole Electronics, Inc.

RES ARRAY 4 RES 130 OHM 0804

0
RAVF104DFT56R0

RAVF104DFT56R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 56 OHM 0804

0
RAVF164DJT39R0

RAVF164DJT39R0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 39 OHM 1206

0
RAVF324DJT56K0

RAVF324DJT56K0

Stackpole Electronics, Inc.

RES ARRAY 4 RES 56K OHM 2012

0
RAVF164DGT100K

RAVF164DGT100K

Stackpole Electronics, Inc.

RES ARRAY 4 RES 100K OHM 1206

0
RAVF104DFT2K00

RAVF104DFT2K00

Stackpole Electronics, Inc.

RES ARRAY 4 RES 2K OHM 0804

0
RAVF328RJT1K00

RAVF328RJT1K00

Stackpole Electronics, Inc.

RES ARRAY 8 RES 1K OHM 1206

0
RAVF164DJT6R80

RAVF164DJT6R80

Stackpole Electronics, Inc.

RES ARRAY 4 RES 6.8 OHM 1206

0

Arrays/Networks Resistors

1. Overview

Resistor arrays/networks are integrated circuits containing multiple resistors in a single package. They provide precise resistance values and spatial efficiency in electronic systems. These components play a critical role in modern electronics by enabling voltage division, signal conditioning, and termination networks while reducing PCB footprint and assembly complexity.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
Bussed Resistor ArraysCommon terminal connection for multiple resistorsDigital logic pull-up/pull-down networks
Isolated Resistor NetworksElectrically separated resistor elementsAnalog signal conditioning circuits
Voltage Divider ArraysPrecisely matched resistor ratiosSensor signal scaling in measurement systems
Termination NetworksHigh-precision impedance matchingHigh-speed data bus termination
Integrated EMI FiltersCombined resistive and capacitive elementsNoise suppression in communication interfaces

3. Structure and Composition

Typical construction features:

  • Ceramic substrate (Al O or AlN) for thermal stability
  • Thin-film or thick-film resistive elements (NiCr, TaN)
  • Termination pads with Ag/Pd or Sn/Pb metallization
  • Molded epoxy encapsulation (for discrete packages)
  • Standard packages: SIP, DIP, SOIC, TSSOP

4. Key Technical Parameters

ParameterSignificance
Resistance Range0.1 to 10M (determines application suitability)
Power Rating50mW to 1W per element (thermal management factor)
Tolerance 0.1% to 5% (precision level indicator)
TCR 25ppm/ C to 100ppm/ C (temperature stability)
Insulation Resistance100M min (isolation performance)
Voltage Rating50V to 200V (safety and breakdown protection)

5. Application Fields

  • Consumer Electronics: Smartphones (LCD biasing), IoT devices
  • Automotive: ECU sensor interfaces, LED lighting control
  • Industrial: PLC signal conditioning, precision instrumentation
  • Telecommunications: Transmission line termination, RF circuits
  • Aerospace: Avionics redundancy systems, navigation equipment

6. Leading Manufacturers and Products

ManufacturerKey Products
Vishay Precision GroupCRCW-HP series (high-precision thin-film)
Panasonic Electronic DevicesEX-H series (automotive-grade networks)
TT ElectronicsWSL series (low-TCR power arrays)
ROHM SemiconductorMNR series (miniaturized resistor networks)
Yageo CorporationRCN series (high-voltage termination arrays)

7. Selection Guidelines

  1. Calculate required resistance values and tolerances
  2. Determine power dissipation requirements per element
  3. Assess temperature coefficient needs based on operating environment
  4. Select package type compatible with PCB layout and assembly process
  5. Consider EMI filtering requirements for high-frequency applications
  6. Evaluate automotive/aerospace certification needs

Industry Trends Analysis

Current development directions include:

  • Miniaturization: 01005-inch footprint arrays for mobile devices
  • Increased integration: Embedded passives in SiP modules
  • Extended reliability: AEC-Q100 qualified parts for EV systems
  • High-precision manufacturing: Laser-trimmed thin-film technology
  • Environmental compliance: Halogen-free and RoHS-compliant packages
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