LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
5510001829F

5510001829F

Dialight

LED CBI 3MM SGL LEVEL RT ANGLE

0

5530222210F

5530222210F

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LED CBI 3MM BI-LVL GRN/GRN DIFF

0

5532223801F

5532223801F

Dialight

LED CBI 3MM BI-LVL GRN/YLW TINT

0

5512807010F

5512807010F

Dialight

LED CBI 3MM BLUE DIFF LC REV POL

0

5502407807F

5502407807F

Dialight

LED CBI 5MM RED DIFFUSED

0

5530748859F

5530748859F

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LED 3MM BI-LEVEL BKLIT Y/G,B

0

5682211232F

5682211232F

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LED CBI 3MM 4X1 RED,GRN,YLW,GRN

0

5640300202F

5640300202F

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LED CBI 3MM 3X1 GRN/X/GRN

0

5503006803F

5503006803F

Dialight

LED CBI 5MM RED/GREEN BI-COLOR

0

5600107F

5600107F

Dialight

LED CBI BI-LEVEL T/H

0

5610004803F

5610004803F

Dialight

LED CBI 2X4MM QUAD ARRAY GRN/YLW

0

5680004820F

5680004820F

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LED CBI 3MM 4X1 YLW,YLW,YLW,YLW

0

5530711210F

5530711210F

Dialight

LED CBI 3MM BI-LVL RD/GN RD/GN

0

5710111102F

5710111102F

Dialight

LED CBI 2MM BI-LEVEL RED-RED

0

5530312004F

5530312004F

Dialight

LED CBI 3MM BI-LVL RED/GRN DIFF

0

5600408F

5600408F

Dialight

LED CBI BI-LEVEL T/H

0

5973221307F

5973221307F

Dialight

LED 2MM AMBER ALLNGAP 592NM SMD

0

5520221803F

5520221803F

Dialight

LED CBI 5MM BI-LVL GRN/RED DIFF

0

HLMP1401104F

HLMP1401104F

Dialight

LED CBI 3MM ARRAY 1X4 YELLOW TH

0

5532203F

5532203F

Dialight

LED CBI 3MM BI-LVL BLANK/YELLOW

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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