LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
5700100112F

5700100112F

Dialight

LED CBI 2MM 3X1 RED,RED,GRN DIFF

0

5532232802F

5532232802F

Dialight

LED CBI 3MM BI-LVL Y/G WATER CLR

0

5670132004F

5670132004F

Dialight

LED 2X4MM BI-LEVEL ARRAY YLW,GRN

0

5680701001F

5680701001F

Dialight

LED CBI 3MM 4X1 R/G,X,X,R/G

0

5510003808F

5510003808F

Dialight

LED CBI 3MM TRI LEVEL RT ANGLE

0

5942804013F

5942804013F

Dialight

1.6MM PRISM WHITE 2MA 13" REEL

3200

593202326302F

593202326302F

Dialight

LED PRISM

0

5613101050F

5613101050F

Dialight

LED CBI 5MM BICLR YLW/GRN 0.500"

0

5680704144F

5680704144F

Dialight

3MM QUAD LVL YG RG YG YG

0

5510307003F

5510307003F

Dialight

LED CBI 3MM HI EFF YLW TRI BLK

0

5530121410F

5530121410F

Dialight

LED CBI 3MM BI-LVL GREEN/RED

0

5680004824F

5680004824F

Dialight

LED CBI 3MM 4X1 R/G,YLW,RED,YLW

0

HLMP1719801F

HLMP1719801F

Dialight

LED CBI 3MM ARRAY 1X4 Y,R,R,G TH

0

5923528313F

5923528313F

Dialight

BI-LVL PRISM RGB-W 13R SIL

0

5640100129F

5640100129F

Dialight

CBI 3MM TRI LVL R G B

0

5530102803F

5530102803F

Dialight

LED CBI 3MM BI-LVL BLANK/GREEN

0

5942001007F

5942001007F

Dialight

1.6MM PRISM RED 625NM 7" REEL

0

5530123803F

5530123803F

Dialight

LED CBI 3MM BI-LVL GREEN/YELLOW

0

5680012803F

5680012803F

Dialight

LED CBI 3MM BI-LEVEL BACKLIGHT

0

56401403334F

56401403334F

Dialight

LED CBI 3MM 3X4 YLW/YLW/YLW

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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