LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
5510406003F

5510406003F

Dialight

LED CBI 3MM HI EFF RED TRI BLK

0

5501205003F

5501205003F

Dialight

LED CBI 5MM YLW TRI LOW CURR

0

5640700822F

5640700822F

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LED CBI 3MM 3X1 R/Y,GRN,GRN DIFF

0

5530233410F

5530233410F

Dialight

LED CBI 3MM BI-LEVEL YLW,YLW

0

5680004819F

5680004819F

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LED CBI 3MM 4X1 X,GRN,GRN,GRN

0

5640140777F

5640140777F

Dialight

LED CBI 3MM 3X1 ORN/ORN/ORN

0

5923530302F

5923530302F

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LED CIRCUIT BOARD INDICATORS

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593202024313F

593202024313F

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LED PRISM

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5530132802F

5530132802F

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LED CBI 3MM BI-LVL YELLOW/GREEN

0

5530203F

5530203F

Dialight

LED CBI 3MM BI-LVL BLANK/YELLOW

0

5640700805F

5640700805F

Dialight

LED CBI 3MM 3X1 GRN,GRN,Y/G

0

5640100211F

5640100211F

Dialight

LED CBI 3MM 3X1 GRN/RED/RED DIFF

0

5510001875F

5510001875F

Dialight

LED CBI 3MM GREEN DIFF RA SGL

0

5530001807F

5530001807F

Dialight

LED CBI 3MM BI-LVL WHT/GRN DIFF

0

5530008831F

5530008831F

Dialight

LED CBI 3MM R,R,G,G,Y,Y,R,R RA

0

5530713819F

5530713819F

Dialight

LED CBI 3MM BI-LVL R/G,GRN DIFF

0

5501107002F

5501107002F

Dialight

LED CBI 5MM RED LC DUAL BLK

0

5530113300F

5530113300F

Dialight

LED CBI 3MM BI-LVL RED/YELLOW

0

5500704100F

5500704100F

Dialight

LED CBI 5MM GRN DIFF TOP VIEW

0

5700100212F

5700100212F

Dialight

LED CBI 2MM 3X1 GRN,RED,GRN DIFF

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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