LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
5511107811F

5511107811F

Dialight

LED CBI 3MM RED DIFFUSED RA .200

0

5501108F

5501108F

Dialight

LED CBI 5MM RED DIFF LO CURR

0

5640700820F

5640700820F

Dialight

LED CBI 3MM 3X1 Y/G,Y/G,Y/G

0

5680101732F

5680101732F

Dialight

LED CBI 3MM 4X1 RED,ORN,YLW,GRN

0

5612601080F

5612601080F

Dialight

LED 5MM VERT HE TINT YLW PC MNT

0

HLMP1301102F

HLMP1301102F

Dialight

LED CBI 3MM ARRAY 1X2 RED TH

0

5600608F

5600608F

Dialight

LED CBI BI-LEVEL T/H

0

5612201802F

5612201802F

Dialight

LED CBI 5MM HE GREEN DIFF VERT

0

5532231110F

5532231110F

Dialight

LED CBI 3MM BI-LVL YLW/RED TINT

0

5513307802MF

5513307802MF

Dialight

3MM CBI .200 CL B/G MF

0

5520701807F

5520701807F

Dialight

LED CBI 5MM BI-LEVEL BLANK/RED

0

5600507F

5600507F

Dialight

LED CBI BI-LEVEL T/H

0

5682211111F

5682211111F

Dialight

LED QUAD LEVEL NON-DIFF 4 COLOR

0

5640140213F

5640140213F

Dialight

LED CBI 3MM 3X1 GREEN/RED/YELLOW

0

5530002819F

5530002819F

Dialight

LED CBI 3MM BI-LEVEL RT ANGLE

0

5510004840F

5510004840F

Dialight

LED CBI 3MM QUAD LEVEL RT ANGLE

0

5512809MF

5512809MF

Dialight

3MMCBI BLUE DIFF LC MF

0

5530223300F

5530223300F

Dialight

LED CBI 3MM BI-LVL GRN/YLW DIFF

0

5612601090F

5612601090F

Dialight

LED 5MM VERT HE TINT YLW PC MNT

0

5640140129F

5640140129F

Dialight

LED CBI 3MM TRI LEVEL RD-GN-BLU

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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