LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

Image Part Number Description / PDF Quantity Rfq
5680202001F

5680202001F

Dialight

LED CBI 3MM 4X1 GRN,X,X,RED

0

5640200322F

5640200322F

Dialight

LED CBI 3MM 3X1 YLW/GRN/GRN

0

5530133004F

5530133004F

Dialight

LED CBI 3MM BI-LVL YELLOW/YELLOW

0

5530721822F

5530721822F

Dialight

LED CBI 3MM BI-LVL GRN,R/G DIFF

0

5501610803F

5501610803F

Dialight

LED CBI 5MM YELLOW TINTED

0

5620003801F

5620003801F

Dialight

LED CBI 3MM 3X1 RED/GREEN/YELLOW

0

5680004861F

5680004861F

Dialight

LED CBI 3MM 4X1 GRN,GRN,X,ORN

0

5682212131F

5682212131F

Dialight

LED CBI 3MM 4X1 GRN,RED,YLW,RED

0

5511509F

5511509F

Dialight

LED CBI 3MM GREEN TINTED RA

0

5500804100F

5500804100F

Dialight

LED CBI 5MM YLW DIFF 15MA TOP VW

0

5510407818F

5510407818F

Dialight

LED CBI 3MM RED DIFF RA .200

0

5502405004F

5502405004F

Dialight

LED CBI 5MM HE RED QUAD BLK

0

HLMP1790104F

HLMP1790104F

Dialight

LED CBI 3MM ARRAY 1X4 GRN 2MA TH

0

5530748862F

5530748862F

Dialight

LED CBI 3MM BI-LEVEL YLW/GRN,BLU

0

56822333334F

56822333334F

Dialight

LED CBI 3MM 4X4 YELLOW

0

5530110F

5530110F

Dialight

LED CBI 3MM BI-LVL RED/BLANK

0

5530102002F

5530102002F

Dialight

LED CBI 3MM BI-LVL BLANK/GREEN

0

5640700813F

5640700813F

Dialight

LED CBI 3MM 3X1 Y/G,BLANK,GN LC

0

5500003812F

5500003812F

Dialight

LED CBI 5MM MULTI BLOCK

0

5505607100F

5505607100F

Dialight

LED CBI 5MM GREEN WATER CLEAR

0

LEDs - Circuit Board Indicators, Arrays, Light Bars, Bar Graphs

1. Overview

Light Emitting Diodes (LEDs) are semiconductor devices that convert electrical energy into light through electroluminescence. This product category includes indicators, arrays, light bars, and bar graphs designed for circuit board integration. LEDs serve critical roles in modern electronics for status indication, data visualization, and illumination. Their advantages include low power consumption, long lifespan, and compact form factors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
IndicatorsSingle/dual-color point-source lighting for status indicationPower switches, network routers, medical device panels
ArraysMatrix configurations for alphanumeric/symbol displaySeven-segment displays, dot matrix modules
Light BarsLinear arrangements for directional lighting/brightness zonesAudio level meters, industrial control panels
Bar GraphsSegmented columns for quantitative visual representationBattery level indicators, sensor data visualization

3. Structure and Components

Typical LED components include:

  • Die: Gallium Nitride (GaN) or Indium Gallium Aluminum Phosphide (InGaAlP) semiconductor chips
  • Substrate: FR4 or metal-core PCB for thermal management
  • Encapsulation: Epoxy resin with diffused/optical lens structures
  • Driver Circuitry: Current-limiting resistors or PWM control ICs

4. Key Technical Specifications

ParameterDescriptionImportance
Luminous Intensity0.1-100 cd/m rangeDetermines visibility in various lighting conditions
Wavelength400-700 nm (visible spectrum)Defines color output accuracy
Forward Current2-30 mA typicalImpacts brightness and longevity
Viewing Angle5-120 depending on lens designDictates light distribution pattern
MTBF50,000-100,000 hoursSystem reliability prediction

5. Application Fields

Key industries include:

  • Consumer Electronics: Smartphones, laptops, home appliances
  • Industrial Automation: PLC status indicators, HMI panels
  • Automotive: Dashboard lighting, warning indicators
  • Medical Equipment: Diagnostic status visualization

6. Leading Manufacturers and Products

ManufacturerProduct SeriesKey Features
CreeXLamp XRHigh-brightness automotive indicators
OSRAMLED LineProgrammable RGB light bars
NichiaNSPWR70CSSUltra-compact bar graph displays
EverlightDLW-5xxxWaterproof array modules

7. Selection Recommendations

Key considerations:

  • Environmental Conditions: Temperature (-40 to +85 C operational range)
  • Optical Requirements: Color consistency (CIE 1931 standard)
  • Electrical Compatibility: Driver circuit matching
  • Form Factor: 0402-5050 package size constraints
  • Cost Optimization: Trade-off between performance and budget

Industry Trend Analysis

Current trends show:

  • Micronization: Development of 0201 package formats
  • Smart Integration: Embedded ICs for addressable lighting
  • Energy Efficiency: Sub-1mA operational current devices
  • Automotive Growth: HUD and LiDAR indicator applications
  • Medical Advancements: UV/IR spectrum specialized indicators

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