LED Indication - Discrete

Part Number	Description / PDF	Quantity
LTL2R3KGKNN Lite-On, Inc.	LED GREEN CLEAR T-1 3/4 T/H	5559
LTW-010DCG Lite-On, Inc.	LED WHITE 2PLCC SMD R/A	0
LTW-C230DS Lite-On, Inc.	LED WHITE 1206 SMD	110
LTL-307EE Lite-On, Inc.	LED RED CLEAR T-1 3/4 T/H	4286
LTL2R3KEK Lite-On, Inc.	LED RED CLEAR T-1 3/4 T/H	6537
LTL-4293 Lite-On, Inc.	LED RED DIFFUSED T-1 3/4 T/H	5006
LTST-C150KRKT Lite-On, Inc.	LED RED CLEAR 1206 SMD	447
LTST-C295TBKFKT Lite-On, Inc.	LED BLUE/ORANGE CLEAR CHIP SMD	0
LTST-C193KFKT-5A Lite-On, Inc.	LED ORANGE CLEAR CHIP SMD	49421
LTST-C195TBJRKT Lite-On, Inc.	LED BLUE/RED CLEAR CHIP SMD	18973
LTL-4213 Lite-On, Inc.	LED RED DIFFUSED T-1 3/4 T/H	18733
LTL42TG6N Lite-On, Inc.	LED GREEN CLEAR T-1 T/H	13198
LTST-E680UBKT Lite-On, Inc.	LED BLUE CLEAR 4PLCC SMD	12728
LTST-T680UBWT Lite-On, Inc.	LED BLUE DIFFUSED 2SMD	0
LTL-4261NR Lite-On, Inc.	LED RED DIFFUSED T-1 T/H	5119
LTL-4251 Lite-On, Inc.	LED YELLOW DIFFUSED T-1 T/H	3448
LTST-C190TBKT Lite-On, Inc.	LED BLUE CLEAR CHIP SMD	0
LTST-C155GYKT Lite-On, Inc.	LED GREEN/YELLOW CLEAR CHIP SMD	2840
LTL-4273 Lite-On, Inc.	LED AMBER DIFFUSED T-1 3/4 T/H	0
LTST-C194KFKT Lite-On, Inc.	LED ORANGE CLEAR SMD	0

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials