LED Indication - Discrete

Part Number	Description / PDF	Quantity
LTJ-811HR Lite-On, Inc.	LED RED DIFFUSED T/H	3091
LTST-S115TGKFKT Lite-On, Inc.	LED GREEN/ORANGE CLEAR 2SMD R/A	8268
LTST-C193KRKT-5A Lite-On, Inc.	LED RED CLEAR CHIP SMD	264016
LTST-S220KRKT Lite-On, Inc.	LED RED CLEAR CHIP SMD R/A	71283
LTW-670DS Lite-On, Inc.	LED WHITE 2PLCC SMD	23633
LTL-30EFJ Lite-On, Inc.	LED GRN/RED DIFFUSED T-1 3/4 T/H	15266
LTST-020ZGL Lite-On, Inc.	LED GREEN CLEAR SMD R/A	10523
LTW-E670DS Lite-On, Inc.	LED WHITE 4PLCC SMD	29047
LTST-020QRL Lite-On, Inc.	LED RED CLEAR SMD R/A	2781
LTW-170TK Lite-On, Inc.	LED WHITE 0805 SMD	35567
LTL2R3KGD-EM Lite-On, Inc.	LED GREEN DIFFUSED T-1 3/4 T/H	203
LTL-1CHAE Lite-On, Inc.	LED AMBER CLEAR T/H	11462
LTST-T680TGWT Lite-On, Inc.	LED GREEN DIFFUSED 2SMD	1177
LTW-C191TL5 Lite-On, Inc.	LED WHITE CHIP SMD	0
LTST-C191KGKT Lite-On, Inc.	LED GREEN CLEAR SMD	0
LTST-C155KGJRKT Lite-On, Inc.	LED GREEN/RED CLEAR CHIP SMD	9850
LTL-307G Lite-On, Inc.	LED GREEN DIFFUSED T-1 3/4 T/H	0
LTST-C170AKT Lite-On, Inc.	LED ORANGE CLEAR SMD	14343
LTL1CHTBK4 Lite-On, Inc.	LED BLUE CLEAR T/H	32798
LTST-S110KRKT Lite-On, Inc.	LED RED CLEAR SMD R/A	68813

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials