LED Indication - Discrete

Part Number	Description / PDF	Quantity
LTST-C930KSKT Lite-On, Inc.	LED YELLOW CLEAR CHIP SMD	69709
LTST-C191TBKT-5A Lite-On, Inc.	LED BLUE CLEAR CHIP SMD	17869
LTL-1CHA Lite-On, Inc.	LED AMBER DIFFUSED T/H	0
LTL1BEKVJNN Lite-On, Inc.	LED GREEN/RED DIFFUSED T/H	64330
LTST-C170CKT Lite-On, Inc.	LED RED CLEAR SMD	0
LTST-C930EKT Lite-On, Inc.	LED ORANGE CLEAR CHIP SMD	0
LTST-S326GEKT Lite-On, Inc.	LED GREEN/RED CLEAR CHIP SMD R/A	1131
LTST-C235KGKRKT Lite-On, Inc.	LED GREEN/RED CLEAR CHIP SMD	104085
LTL-307P Lite-On, Inc.	LED RED DIFFUSED T-1 3/4 T/H	0
LTL353QRKNN Lite-On, Inc.	LED RED CLEAR T-1 3/4 T/H	10000
LTL1CHKSKNN Lite-On, Inc.	LED YELLOW CLEAR T-1 T/H	2377
LTST-S220KSKT Lite-On, Inc.	LED YELLOW CLEAR CHIP SMD R/A	35899
LTW-S272TLA Lite-On, Inc.	LED WHITE SMD	6141
LTST-C930CKT Lite-On, Inc.	LED RED CLEAR CHIP SMD	12040
LTST-S270KFKT Lite-On, Inc.	LED ORANGE CLEAR SMD R/A	15497
LTST-C150TGKT Lite-On, Inc.	LED GREEN CLEAR 1206 SMD	297
LTST-S270KRKT Lite-On, Inc.	LED RED CLEAR CHIP SMD R/A	42370
LTST-C171KRKT Lite-On, Inc.	LED RED CLEAR SMD	0
LTST-S326KGJRKT Lite-On, Inc.	LED GREEN/RED CLEAR CHIP SMD R/A	4927
LTL42EKEKNN Lite-On, Inc.	LED RED CLEAR T-1 T/H	13514

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials