LED Indication - Discrete

Part Number	Description / PDF	Quantity
APECVA3010SYCK Kingbright	LED YELLOW CLEAR SMD R/A	0
AA3527ASYSK/J3-50MAV Kingbright	LED YELLOW CLEAR SMD	9737
WP710A10ZGC/G Kingbright	LED GREEN CLEAR T-1 T/H	25363
APL3015QBC/D-F01 Kingbright	LED BLUE CLEAR CHIP SMD	18371
APD3224ZGCK-F01 Kingbright	LED GREEN CLEAR 2SMD	18951
APDA3020SYCK/J3-PF Kingbright	LED YELLOW CLEAR SMD R/A	26914
APHCM2012SURCK-F01 Kingbright	LED RED CLEAR CHIP SMD	53640
APHB1608LCGKSURKC Kingbright	LED GREEN/RED CLEAR 4SMD	0
APDA3020SECK/J3-PF Kingbright	LED RED CLEAR SMD R/A	85682
APT2012SYCK/J3-PRV Kingbright	LED YELLOW CLEAR CHIP SMD	21666
AA3021ZGS Kingbright	LED GREEN CLEAR SMD	23937
WP7113SRD/F Kingbright	LED RED DIFFUSED T-1 3/4 T/H	1625
APT3216SYCK Kingbright	LED YELLOW CLEAR CHIP SMD	29103
AM23ESGC Kingbright	LED GREEN/RED CLEAR SOT23-3 SMD	16125
WP710A10YC Kingbright	LED YELLOW CLEAR T-1 T/H	0
WP119EGWT Kingbright	LED GRN/RED DIFF RECT 2X5MM T/H	4498
APG1608PBC/A Kingbright	LED BLUE CLEAR CHIP SMD	0
AM2520SGC09 Kingbright	LED GREEN CLEAR SMD	39180
APHF1608LSEEQBDZGKC Kingbright	LED RGB CLEAR 4SMD	80316
APBVA3010SYKCGKC Kingbright	LED GREEN/YLW CLEAR CHIP SMD R/A	0

LED Indication - Discrete

1. Overview

Discrete Light Emitting Diodes (LEDs) are single-chip optoelectronic devices that convert electrical energy into light through electroluminescence. This product category forms the foundation of modern indication systems, offering advantages including low power consumption, long lifespan, and high reliability. Their importance spans across consumer electronics, industrial equipment, automotive systems, and communication infrastructure.

2. Major Types and Functional Classification

Type	Functional Characteristics	Application Examples
Visible LEDs	Emits light in visible spectrum (400-700nm), available in multiple colors	Indicator lamps, display backlighting, decorative lighting
Infrared LEDs	Emits 700nm-1mm wavelength radiation, invisible to human eye	Remote controls, security sensors, night vision systems
High-Brightness LEDs	Enhanced luminous intensity (>1000mcd) with advanced packaging	Automotive lighting, outdoor displays, emergency signage
UV LEDs	Ultraviolet spectrum emission (280-400nm)	Sterilization equipment, counterfeit detection, curing systems

3. Structure and Composition

Typical discrete LED construction includes:

Die: Semiconductor chip (GaN/InGaN for blue/green, AlGaInP for red)
Encapsulation: Epoxy or silicone lens for light extraction and protection
Lead Frame: Copper or iron alloy for electrical connection and heat dissipation
Phosphor Coating: Used in white LEDs for wavelength conversion
Reflective Cup: Optimizes light directionality

4. Key Technical Parameters

Parameter	Significance	Typical Range
Wavelength	Determines light color and application suitability	375nm-940nm
Luminous Intensity	Measures brightness output (mcd)	50-10,000mcd
Forward Current	Operating current rating	20-150mA
Forward Voltage	Electrical potential drop	1.8-3.6V
Viewing Angle	Light emission spread measurement	5 -120

5. Application Fields

Primary application sectors include:

Consumer Electronics: Mobile phone indicators, keyboard backlighting
Automotive: Dashboard indicators, brake light systems
Industrial: Machine status indicators, safety signage
Medical: Diagnostic equipment indicators, phototherapy devices
Telecommunications: Network equipment status lights

6. Leading Manufacturers and Products

Manufacturer	Product Series	Key Features
Cree Inc.	XLamp XP-G3	High brightness (3200mcd), 120 viewing angle
OSRAM Opto	OSTAR Projection	High-power LED for automotive lighting
Nichia Corp.	NSHU5991	UV LED (365nm) for curing applications
Everlight Electronics	LTST-C19HE8WT	Tri-color LED for RGB indication

7. Selection Recommendations

Key consideration factors:

Spectral Requirements: Match wavelength to application needs
Environmental Conditions: Temperature range (-40 C to +85 C typical)
Power Constraints: Select appropriate current/voltage ratings
Optical Design: Consider lens type and viewing angle
Reliability: Check MTTF (Mean Time to Failure) specifications

Industry Development Trends

Current technology directions include:

Miniaturization: Development of micro-LED ( LED) with dimensions <50 m
Efficiency Improvement: Targeting >300lm/W efficacy for visible LEDs
Smart Integration: Incorporating driver ICs and sensors in LED packages
Material Innovation: GaN-on-silicon substrates for cost reduction
Regulatory Compliance: RoHS/REACH compliant packaging materials