Accessories

Image Part Number Description / PDF Quantity Rfq
1132931200

1132931200

Dialight

PMI CAP RED 15/32 MOUNT HOLE

0

1782131500

1782131500

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PMI CAP RED FACET 15/32 TRANSP

0

101503009101

101503009101

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PMI BASE 15/32 INCAND MIDG SLDR

0

095046309332

095046309332

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PMI BASE 11/16 NEON BAY SOLDER

0

031091401100

031091401100

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PMI BASE NEON 1 T-4 1/2 CANDLBR

0

2713171

2713171

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PMI CAP 15/32 STOVEP RED TRANSL

0

262041003100

262041003100

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PMI BASE 11/16 INCAND BAY SOLDER

0

051090101200

051090101200

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PMI BASE 1INCAND S6 CNDLBR SCRW

0

070041011200

070041011200

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PMI BASE 9/16 INCAND BAY SOLDER

0

9904700006

9904700006

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LED ACCESSORY LENS

0

8301432003

8301432003

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PRESS TO TEST IND

0

080131009301

080131009301

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PMI BASE PANEL MOUNT INDICATOR

0

080040805341

080040805341

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PMI BASE 1NEON T-3 1/4 BAY SLDR

0

5270010

5270010

Dialight

PMI IND PRESS TO TEST

0

5270006

5270006

Dialight

PMI IND PRESS TO TEST

0

095136309332

095136309332

Dialight

PMI BASE 11/16 NEON BAY SCREW

0

021041029201

021041029201

Dialight

PMI BASE 11/16 INCAND SOLDER

0

026041011203

026041011203

Dialight

PMI BASE BAYO 11/16 INCAND SLDR

0

080136309310

080136309310

Dialight

PMI BASE PANEL MOUNT INDICATOR

0

070131011105

070131011105

Dialight

PMI BASE 9/16 INCAND BAY SCREW

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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