Accessories

Image Part Number Description / PDF Quantity Rfq
123946312163

123946312163

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PMI BASE 11/16 NEON BAY SOLDER

0

085041001203

085041001203

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PMI BASE 11/16 INCAND BAY SLDR

0

080091405303

080091405303

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PMI BASE 1 NEON CNDLBR SCREW

0

033131001200

033131001200

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PMI BASE 9/16INCAN T-3 1/4 SCRW

0

047310129300

047310129300

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PMI BASE 1INCAND S6 CNDLBR SCRW

0

080350205303

080350205303

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PMI BASE 1 INCAND S-6 BAY SCREW

0

1691132300

1691132300

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PMI CAP STOVEP GRN 11/16 TRANSP

0

019041005301

019041005301

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PMI BASE T-3 1/4 BAYO 1INC SLDR

0

021041029200

021041029200

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PMI BASE 11/16 INCAND SOLDER

0

9904700004

9904700004

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LED ACCESSORY LENS

0

2501474500

2501474500

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DATA CAP 3/8 BLUE TRANSLUCENT

0

026936311361

026936311361

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PMI BASE NEON 11/16 T-3 1/4 SCRW

0

8150332503

8150332503

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IND PRESS TO TEST GREEN

0

080311409301

080311409301

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PMI BASE 1 NEON T-4 1/2 CNDLBRA

0

008193001203

008193001203

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PMI BASE T-1 3/4 15/32 SOLDER

0

1780375500

1780375500

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PMI CAP WHT FLAT 15/32 TRANSLUC

0

095940809381

095940809381

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PMI BASE 11/16 NEON BAY SOLDER

0

019320205400

019320205400

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PMI BASE S-6 BAYO 1 INCAND SCRW

0

095940809380

095940809380

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PMI BASE 11/16 NEON BAY SOLDER

0

095136309211

095136309211

Dialight

PMI BASE 11/16 NEON BAY SCREW

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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