Accessories

Image Part Number Description / PDF Quantity Rfq
019340605303

019340605303

Dialight

PMI BASE G-6 BAYO 1 INCAND SLDR

0

101503009301

101503009301

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PMI BASE 15/32 INCAND MIDG SLDR

0

037041001205

037041001205

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PMI BASE 9/16INCAN T-3 1/4 SLDR

0

LML6LVM2MCAB

LML6LVM2MCAB

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POWERWHITE LV CONNECTOR CABLE

0

047090129301

047090129301

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PMI BASE 1INCAND S6 CNDLBR SCRW

0

008193001201

008193001201

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PMI BASE T-1 3/4 15/32 SOLDER

0

095511009100

095511009100

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PMI BASE 11/16 INCAND BAY QC

0

5280001

5280001

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PMI IND PRESS TO TEST

0

026836311370

026836311370

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PMI BASE NEON 11/16 T-3 1/4 QC

0

061350602303

061350602303

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PMI BASE 1 INCAND G-6 BAYO SCRW

0

2701830700

2701830700

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PMI BASE 15/32 INCAND SCREW

0

080350605301

080350605301

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PMI BASE 1 INCAND G-6 BAY SCREW

0

080040805271

080040805271

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PMI BASE 1NEON T-3 1/4 BAY SLDR

0

041320201102

041320201102

Dialight

PMI BASE 1 INCAND S6 BAYO SCRW

0

1340352203

1340352203

Dialight

PMI CAP GRN FLAT 15/32 TRANSLUC

0

037040801276

037040801276

Dialight

PMI BASE 9/16 NEON T-3 1/4 SLDR

0

080311405300

080311405300

Dialight

PMI BASE 1INCAND S6 CNDLBR SCRW

0

031091401101

031091401101

Dialight

PMI BASE NEON 1 T-4 1/2 CANDLBR

0

377046311223

377046311223

Dialight

PMI BASE 11/16 NEON BAY SOLDER

0

051340201300

051340201300

Dialight

PMI BASE 1 INCAND S-6 BAY SLDR

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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