Accessories

Image Part Number Description / PDF Quantity Rfq
031090105101

031090105101

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PMI BASE 1 INCAND S6 CANDELBRA

0

085131001300

085131001300

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PMI BASE 11/16 INCAND BAY SCREW

0

9904700008

9904700008

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LED ACCESSORY LENS

0

2230331203

2230331203

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PMI IND CAP SUB MINI RED

0

019340205301

019340205301

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PMI BASE S-6 BAYO 1 INCAND SLDR

0

026136311311

026136311311

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PMI BASE NEON 11/16 T-3 1/4 BAY

0

095130809370

095130809370

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PMI BASE 11/16 NEON BAY SCREW

0

36884300111805

36884300111805

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PMI ASSY 15/32 RED INCAND 6V

0

080091409300

080091409300

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PMI BASE 1 NEON CNDLBR SCREW

0

1691113203

1691113203

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PMI CAP STOVEP YLW 11/16 FROSTED

0

1090133200

1090133200

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PMI T-1 3/4 INCAND AMBER UNFROST

0

169046311311

169046311311

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PMI BASE 11/16 NEON BAY SOLDER

0

5088745604

5088745604

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DATALAMP HOLDER 3/8 W/COLLAR

0

169041011301

169041011301

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PMI BASE 11/16 INCAND BAY SOLDER

0

5270004

5270004

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PMI IND PRESS TO TEST

0

5340701030

5340701030

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CAP KIT FILTER/LENS RD,GN,AMB,BL

0

5270003

5270003

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PMI IND PRESS TO TEST

0

080350205301

080350205301

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PMI BASE 1 INCAND S-6 BAY SCREW

0

1901872

1901872

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IND SWITCH IPS 3/4 SQUARE GREEN

0

041511004923

041511004923

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PMI BASE 1INCAND T-3 1/4 BAY QC

0

Accessories

1. Overview

Optoelectronics accessories refer to components that interface, control, or enhance the performance of optoelectronic systems. These include devices that manage light signals in fiber optics, sensors, lasers, and imaging systems. They play a critical role in telecommunications, data transmission, industrial automation, and medical diagnostics by enabling precise light manipulation and signal integrity.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Optical ConnectorsSecure fiber alignment, low insertion lossTelecom networks, data centers
Optical CouplersSplit/combine light signalsPON networks, sensing systems
Optical IsolatorsPrevent back-reflection interferenceLaser protection, high-speed transceivers
Optical AttenuatorsControl signal power levelsEDFA amplifiers, FTTH networks
Photodetector ModulesConvert optical to electrical signalsLiDAR, optical sensors

3. Structure and Components

Typical optoelectronic accessories consist of: - Optical interfaces (e.g., ceramic ferrules in connectors) - Active/passive optical elements (e.g., thin-film filters, waveguides) - Mechanical housings (aluminum alloy or plastic for environmental protection) - Electrical contacts (for signal/power transmission) - Thermal management layers (to maintain stability under varying temperatures)

4. Key Technical Specifications

ParameterSignificance
Wavelength Range (nm)Determines compatibility with light sources (e.g., 1260-1650nm for telecom)
Insertion Loss (dB)Measures signal power loss through the component
Return Loss (dB)Indicates reflection suppression capability
Operating Temperature ( C)Defines environmental tolerance (-40 to +85 C typical)
Optical Power Handling (mW)Maximum power without performance degradation

5. Application Fields

Major industries include: - Telecommunications (DWDM systems, 5G infrastructure) - Medical (endoscopy, optical coherence tomography) - Industrial (laser material processing, machine vision) - Consumer Electronics (3D sensing, display technologies) - Aerospace (fiber optic gyroscopes, LiDAR)

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
Finisar (II-VI)FMT series optical transceivers
Avago TechnologiesHFBR series fiber optic modules
LumentumWaveReady optical components
Hamamatsu PhotonicsG12157 photodetector arrays

7. Selection Recommendations

Key considerations: - Match wavelength specifications with system requirements - Verify environmental ratings (temperature, humidity) - Assess mechanical durability (e.g., connector mating cycles) - Check compliance with standards (e.g., Telcordia GR-326-CORE) - Balance cost-performance ratio for volume deployments

8. Industry Trends

Emerging trends include: - Development of silicon photonics for compact integration - 400G/800G high-speed transmission components - AI-driven smart optoelectronic packaging - Wide adoption of VCSEL-based 3D sensing - Green manufacturing processes reducing material waste

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