Bobbins (Coil Formers), Mounts, Hardware

Part Number	Description / PDF	Quantity
B66208B1110T001 TDK EPCOS	BOBBIN COIL FORMER E 25 X 13 X 7	3332
B66359X1014T001 TDK EPCOS	BOBBIN COIL FORMER ETD 29X16X10	8
B66206J1106T001 TDK EPCOS	BOBBIN COIL FORMER E 20 X 10 X 6	393
B66206A2001X000 TDK EPCOS	YOKE E 20 X 10 X 6	1498
B66364W1016T001 TDK EPCOS	BOBBIN COIL FORMER ETD 39X20X13	174
B65542A5000X000 TDK EPCOS	INSULATING WASHER P 14 X 8	223
B66368A2000X000 TDK EPCOS	YOKE ETD 49 X 25 X 16	1173
B65812C1512T001 TDK EPCOS	BOBBIN COIL FORMER RM 8	366
B64292A1104X000 TDK EPCOS	HOUSING VERTICAL TOROIDS	1076
B65888A2002X000 TDK EPCOS	CLAMP RM 14	332
B65662B0000T001 TDK EPCOS	BOBBIN COIL FORMER P 22 X 13	0
B65549E0004X023 TDK EPCOS	ADJUSTMENT SCREW P 14 X 8	1999
B65888C1512T001 TDK EPCOS	BOBBIN COIL FORMER RM 14	148
B66396A2000X000 TDK EPCOS	YOKE ETD 54 X 28 X 19	171
B65647A2000X000 TDK EPCOS	MOUNTING ASSEMBLY PM 50 X 39	52
B65535B0002X000 TDK EPCOS	YOKE P 11 X 7	916
B64292A1008X000 TDK EPCOS	HOUSING VERTICAL TOROIDS	1417
B64291A1604X000 TDK EPCOS	HOUSING HORIZONTAL TOROIDS	56
B66366A2000X000 TDK EPCOS	YOKE ETD 44 X 22 X 15	798
B66243B1018T001 TDK EPCOS	BOBBIN COIL FORMER E 42X21X20	62

Bobbins (Coil Formers), Mounts, Hardware

1. Overview

Bobbins (coil formers), mounts, and hardware are critical mechanical components in magnetic devices. Bobbins serve as structural supports for wound coils in transformers and inductors, while mounts/hardware ensure mechanical stability and electrical connectivity. These components enable precise winding alignment, thermal management, and electromagnetic interference (EMI) control, playing a vital role in power electronics, automotive systems, and industrial equipment.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Transformer Bobbins	Provide winding support with insulation barriers	Switch-mode power supplies (SMPS), AC/DC converters
Inductor Coil Formers	Enable precise winding geometry for inductance control	DC/DC converters, EMI filters
PCB Mounts	Secure components to printed circuit boards	Telecom equipment, automotive ECUs
Core Clamps	Mechanical fixation for ferrite/powder cores	High-frequency transformers, PFC circuits

3. Structure and Composition

Typical bobbin structures include:

Central core with winding windows
Insulation barriers (e.g., UL-certified materials)
Termination options: PCB pins, wire terminals
Thermal vias for heat dissipation

Mounts/hardware feature:

Anti-vibration rubber
Corrosion-resistant platings (nickel, zinc)
Adjustable positioning brackets

4. Key Technical Specifications

Parameter	Importance
Temperature Resistance (130-200 C)	Determines thermal stability and lifespan
Dielectric Strength (>2kV)	Ensures safety isolation between windings
Dimensional Tolerance ( 0.05mm)	Impacts winding machine compatibility
Tensile Strength (>50MPa)	Prevents mechanical deformation under load
Surface Resistivity (10^12 )	Prevents leakage current paths

5. Application Fields

Power Electronics: 5G base station PSUs, solar inverters
Automotive: On-board chargers (OBC), 48V DC/DC converters
Industrial: CNC machine power supplies, motor drives
Consumer: Fast chargers, LED drivers

6. Leading Manufacturers

Manufacturer	Representative Products
TDK-Lambda	Compact PCB-mount bobbin series for telecom
Sumec Corporation	High-temp composite coil formers
Eaton Electronics	Vibration-resistant inductor mounts
Fastron IC	Customizable toroidal core hardware kits

7. Selection Guidelines

Key considerations:

Material compatibility with expected operating temperatures
Dimensional matching to core geometries (ETD, PQ, RM types)
Vibration resistance for automotive applications
RoHS compliance for environmental regulations
Cost optimization through standard vs. customized designs

Case Study: Electric vehicle chargers use high-temperature bobbins (UL 1557 recognized) to withstand 150 C continuous operation.

8. Industry Trends

Emerging developments include:

Miniaturization through liquid crystal polymer (LCP) materials
Integrated cooling channels in bobbin designs
Smart mounts with embedded temperature sensors
Increased adoption of 3D-printed custom hardware

Market drivers: Electrification of transportation, 5G infrastructure deployment, and energy-efficient appliance standards.